AMD Ryzen AI 5 PRO 435 vs AMD Ryzen AI 7 PRO 450
AMD Ryzen AI 5 PRO 435
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The AMD Ryzen AI 5 PRO 435 or AI 5 H PRO 435 is a mid-range mobile processor from the Gorgon Point family that was announced at CES in Jan 2026. The laptop APU features 6 CPU cores (2x Zen 5 with up to 4.5 GHz, 4x Zen 5c with less cache and a 3.4 GHz maximum clock speed), a Radeon 840M iGPU and a 50-TOPS NPU, and is similar to the older AMD Ryzen AI 5 PRO 340 (3x Zen 5 at up to 4.8 GHz, 3x Zen 5c at up to 3.4 GHz, Radeon 840M iGPU, 50-TOPS NPU).
Compared to the consumer Ryzen AI 5 435, the PRO variant offers additional management and security features like support for ECC RAM. The China-targeted H version may have a set of hardware-accelerated cryptographic features different to the global chip.
Architecture and features
Gorgon / Krackan Point family APUs are powered by Zen 5 and Zen 5c microarchitecture cores, the latter being a slightly slower, smaller and more energy-efficient version of the former. One of the key differences between the two is, Zen 5 cores have larger caches to play with.
The mobile Zen 5 implementation is reportedly (ChipsAndCheese) closer to desktop Zen 4 than desktop Zen 5 due to the different cache sizes, AVX512 throughput, and other factors.
Elsewhere, the Ryzen AI 5 chip supports DDR5-5600 and LPDDR5x-8000 RAM, giving system designers a choice between lower latency and higher throughput. The APU is natively compatible with USB 4 (and therefore Thunderbolt). It has PCIe 4.0 support for a throughput of 1.9 GB/s per lane, just like its 300-series predecessors. The integrated XDNA 2 NPU delivers up to 50 INT8 TOPS for accelerating various AI workloads.
As usual with laptop CPUs, the Ryzen AI 5 PRO cannot be replaced by the user as it is soldered-in.
The 4 nm TSMC process these CPUs are manufactured with ensures average energy efficiency, as of early 2026.
CPU performance
Given the specs similarity, the PRO 435 should be just slightly slower than the outgoing AMD Ryzen AI 5 340 (or the AI 5 PRO 340) putting it in the same ballpark as the Ryzen 7 8840U, Core Ultra 7 256V and Core Ultra 7 258V.
GPU performance
The Radeon 840M only has a quarter of the Radeon 890M's Compute Units, so just 4 (meaning, 256 unified shaders). It runs at up to 2.9 GHz and isn't powerful enough for anything resembling serious 1080p or even 720p gaming, as of Jan 2026. Hardware AV1, VP9, HEVC and AVC decoding is supported, as are 8K 4320p monitors.
Power consumption
The 435 has a recommended base TDP of 28 watts, making this a P-class chip, although laptop manufacturers are free to set the value to anything between 15 and 54 W.
AMD Ryzen AI 7 PRO 450
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The AMD Ryzen AI 7 PRO 450 or AI 7 H PRO 450 is a powerful mobile processor from the Gorgon Point family and was announced early 2026. The APU integrates 8 CPU cores (4x Zen 5 with up to 5.1 GHz and 4x Zen 5c with less cache and probably a maximum of 3.6 GHz). The CPU is identical to the older Ryzen AI 7 350 except for the 100 MHz higher CPU clock rate and support for LPDR5-8533. Compared to the consumer Ryzen AI 7 450, the PRO variant offers additional management and security features like support for ECC RAM.
Architecture and features
The Gorgon and Krackan Point family APUs are powered by Zen 5 and Zen 5c microarchitecture cores located in separate clusters, the latter being a slightly slower, smaller and more energy-efficient version of the former. One of the differences between Zen 5 and Zen 5c is the size of the cache; the Zen 5 cores have larger caches available.
However, the mobile Zen 5 implementation is reportedly (ChipsAndCheese) is closer to desktop Zen 4 than desktop Zen 5 due to the different cache sizes, large differences in AVX-512 throughput, and other factors.
Elsewhere, the Ryzen AI 7 chip supports LPDDR5x-8533 RAM. The chip is natively compatible with USB 4 (and thus Thunderbolt). It has PCIe 4.0 support for a throughput of 1.9 GB/s per lane, just like its 8000 series predecessors. The integrated XDNA 2 NPU, which is much more complex than the first generation XDNA, delivers up to 50 INT8 TOPS for accelerating various AI workloads.
As usual with laptop CPUs, the Ryzen 7 AI chip cannot be replaced by the user as it is soldered.
Performance
Due to the only slightly higher clock rate, the performance should only be slightly above the old Ryzen AI 7 350 chip. Compared to Intel, the performance should be comparable to an Intel Core i7-13900H should be comparable.
Graphics
The Radeon 860M is the direct successor to the Radeon 760M and offers 8 cores (CUs = 512 shaders) and clocks at up to 3.1 GHz. It uses the new RDNA 3.5 architecture.
Power consumption
The AI 450 is said to have a base TDP of 28 W, although laptop manufacturers are free to set the TDP between 15 and 54 W.
The 4 nm TSMC process with which these CPUs are manufactured ensures above-average energy efficiency.
| Model | AMD Ryzen AI 5 PRO 435 | AMD Ryzen AI 7 PRO 450 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Codename | Gorgon Point | Gorgon Point | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Series | AMD Strix / Gorgon Point | AMD Strix / Gorgon Point | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Series: Strix / Gorgon Point Gorgon Point |
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| Clock | 2000 - 4500 MHz | 2000 - 5100 MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| L2 Cache | 6 MB | 8 MB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| L3 Cache | 8 MB | 16 MB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Cores / Threads | 6 / 12 2 x 4.5 GHz AMD Zen 5 4 x 3.4 GHz AMD Zen 5c | 8 / 16 4 x 5.1 GHz AMD Zen 5 4 x 3.6 GHz AMD Zen 5c | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TDP | 28 Watt | 28 Watt | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Technology | 4 nm | 4 nm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| max. Temp. | 100 °C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Socket | FP8 | FP8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Features | DDR5-5600/LPDDR5x-8000 RAM, PCIe 4, USB 4, XDNA 2 NPU (50 TOPS), Secure Processor, SMT, MMX, SSE, SSE2, SSE3, SSSE3, SSE4A, SSE4.1, SSE4.2, AVX, AVX2, AVX512, BMI2, ABM, FMA, ADX, SMEP, SMAP, CPB, AES-NI, RDRAND, RDSEED, SHA, SME | DDR5-5600/LPDDR5x-8000 RAM, PCIe 4, USB 4, XDNA 2 NPU (50 TOPS), Secure Processor, SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| iGPU | AMD Radeon 840M ( - 2800 MHz) | AMD Radeon 860M ( - 3100 MHz) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NPU / AI | 50 TOPS INT8 | 50 TOPS INT8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Chip AI | 59 TOPS INT8 | 66 TOPS INT8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Architecture | x86 | x86 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Announced | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Manufacturer | www.amd.com | www.amd.com | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TDP Turbo PL2 | 54 Watt |
Benchmarks
Average Benchmarks AMD Ryzen AI 7 PRO 450 → 0% n=0
* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation
