Qualcomm is yet to release the Snapdragon 775 or Snapdragon 775G, sometimes referred to by its part number of SM7350. If the Snapdragon 765 and Snapdragon 765G are anything to go by, then the Snapdragon 775 will be the SM7350-AA, while the Snapdragon 775G will be the SM7350-AB. However, Roland Quandt has revealed that Qualcomm has developed an SM7325, too.
It is unclear what Qualcomm will call the SM7325, but its part number suggests that it will be a cheaper alternative to the SM7350. According to Quandt, the SM7325 supports up to 16 GB of RAM, but Qualcomm has made test platforms with up to 12 GB of LPDDR5 RAM available to hardware partners. These test platforms also have 256 GB of UFS 3.1 flash storage, which matches with a leak about the Snapdragon 775 and the Snapdragon 775G that emerged last week.
Quandt has provided details about the SM7325's core configuration, too. For context, the Snapdragon 765G has eight processor cores split into two clusters: a performance cluster with two ARM Cortex-A76 cores and a power efficiency cluster with six ARM Cortex-A55 cores. By contrast, the SM7325 has one CPU clocked at 2.7 GHz, three cores at 2.4 GHz and four cores at 1.8 GHz. Quandt has not described what these cores are, but their arrangement suggests that the SM7325 has a Prime core, three performance cores and four power-efficiency cores.
If the above information is correct, then the SM7325's core configuration will be comparable to the Snapdragon 888. The Snapdragon 775 and Snapdragon 775G are expected to feature a Kryo 6xx series CPU like the Snapdragon 888, too.
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