Leaker speculates AMD's next-gen RDNA3 cards may not feature multiple GPU chiplets as a new AMD GPU patent surfaces

We have heard many rumors claiming AMD’s upcoming RDNA3 lineup will contain Multi-Chip-Module (MCM) designs with more than one GCD (Graphics Complex Dies), at least for the more powerful products. The Navi 31 and the Navi 32 GPUs, reportedly set to make an appearance in the Radeon RX 7900 XT and the Radeon RX 7700 XT, are rumored to be packing separate 5 nm GDCs and 6 nm MCDs (Memory Complex Dies).

RedGamingTech has now received an AMD patent allegedly describing Team Red’s MCM designs in detail. Titled “Systems and methods for distributed rendering using two-level binning”, the patent sheds some light on the way multiple chips would work together in a GPU. RedGamingTech states that the patent is a continuation of a previous filing.

Although we have had a lot of leaks confirm that AMD is going to be bringing multiple GPU chiplets to some RDNA3 boards, RedGamingTech believes that the Radeon RX 7000 GPUs will all have a single GCD with Navi 33 being a completely monolithic design. The leaker also thinks that a multi-chip version of the Navi 32 may also come out as a refresh later down the line.

Additionally, RedGamingTech also speculates that the patent might not be for RDNA3 but RDNA4. In other words, RDNA4 may be the MCM design with multiple GCDs that many people believe RDNA3 to be.

As with all the leaks, the information presented by the leaker, aside from the patent, is purely conjecture, so take it with a grain of salt. However, we’ll know soon what AMD has in store for us as the company is planning to launch the RDNA3-based graphics boards before the end of 2022.

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