Intel's 2024 Lunar Lake processors to be specifically designed for ultrathin and light laptops

During Intel’s latest Investor Webinar, EVG & GM of Client Computing, Michelle Johnston Holthaus revealed new details about the Lunar Lake processors that “will achieve product readiness in 2024” along with the first look at how different tiles are arranged on the 3D package. The main point is that Lunar Lake will feature a new architecture “designed from the ground-up” specifically for mobile devices.

This year, Intel is introducing a 3D stacked disaggregated design combining a tile-based structure with the Foveros interconnect technology on the Meteor Lake processor family. Lunar Lake will upgrade this design with new CPU, GPU (Xe2-LPG architecture) and VPU cores at a lower power envelope. Intel’s internal slide mentions a combination between the proprietary 18A process and an unnamed TSMC production node (most likely N3E), which should target default TDPs of 15 W.

The mobility aspect is further emphasized as Michelle Johnston Holthaus explains that Lunar Lake is “architected in close collaboration with [...] operating system partners to provide all-day battery life without sacrificing performance.” Thanks to the optimized performance / Watt target, an improved Intel EVO platform should enable laptop OEMs to create even thinner and lighter devices with no compromise.

More details on Intel’s upcoming processor families will be shared on January 26 with the earnings report for Q4 2022.

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