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Samsung faces Snapdragon 820 overheating issues

The company is currently working on a patch to the chipset's control software. If this does not help, Samsung plans to use heat-pipes to improve heat dissipation.

Qualcomm's new SoC, the Snapdragon 820, is reportedly going to enter the market early next year inside as many as 30 devices, including Samsung Galaxy S7. However, according to a report from Business Korea, Samsung has encountered problems with the chip overheating in some scenarios.

The company is currently working on a patch to the chipset's control software in order to overcome the issue. If this does not help, Samsung's plan B is to use heat-pipes to improve heat dissipation. This shows that even though Samsung is perfectly capable of equipping its new flagship with own Exynos processors, the company wants to put launch the Galaxy S7 with Snapdragon 820 inside at all costs. 

The reason for Samsung working so hard to fix the issue is that Qualcomm will produce the 820 using Samsung's 14 nm FinFET technology and its foundries. Therefore, stable performance of Snapdragon 820 means higher sales for both the Galaxy S7 and Samsung's semiconductor business.

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> Notebook / Laptop Reviews and News > News > News Archive > Newsarchive 2015 10 > Samsung faces Snapdragon 820 overheating issues
Arkadiusz Piasek, 2015-10-27 (Update: 2015-10-27)