Qualcomm Snapdragon 7 Gen 4 SM7750-AB vs MediaTek Dimensity 8400
Qualcomm Snapdragon 7 Gen 4 SM7750-AB
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Qualcomm's Snapdragon 7 Gen 4 (SM7750-AB) is a relatively high-performance SoC for Android tablets, phones and handhelds. It debuted in Q2 2025 as a successor to the 7 Gen 3 with a wide array of latest-gen features, such as Bluetooth 6.0 and Wi-Fi 7, onboard.
According to Qualcomm, the Snapdragon 7 Gen 4 offers 27 percent stronger CPU performance and a 30 percent faster graphics chip than the Snapdragon 7 Gen 3. As usual, however, Qualcomm does not go into detail about the built-in ARM Cortex processor cores.
The manufacturer only mentions a prime core with boost clock speeds of up to 2.8 GHz, four performance cores with clock speeds of up to 2.4 GHz, and three efficiency cores with clock speeds of up to 1.8 GHz. Qualcomm is therefore replacing one of the efficiency cores with another performance core and increasing the clock speeds of the prime core. According to Androidauthority, ARM Cortex-A520 and A720 cores are being used.
The Adreno 722 serves as the integrated GPU and there is some kind of an AI engine - a greatly improved one, Qualcomm claims - too.
MediaTek Dimensity 8400
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The MediaTek Dimensity 8400 is an ARM-based SoC (system-on-a-chip) for smartphones that is manufactured using the 4 nm process. In terms of performance, the processor is in the upper class and supports all current mobile communications standards including 5G SA.
The MediaTek Dimensity 8400 works with eight ARM Cortex-A725 cores based on an "all-big-core design" that relies entirely on performance cores. One ARM Cortex-A725 core operates at 3.25 GHz, three others at 3.0 GHz, while the remaining four cores serve as energy-efficient performance cores and run at up to 2.1 GHz.
At the same time, the ARM cores rely on different amounts of L2 cache memory: 1 core with 1 MB, 3 cores with 512 KB and 4 cores with 256 KB. LPDDR5x-8533 RAM can be used as RAM and UFS 4.0 is supported as internal memory.
Compared to its predecessor, the MediaTek Dimensity 8300, the MediaTek Dimensity 8400 is said to achieve up to 41 percent higher multi-core performance, while the ARM Mali-G720 MC7 graphics unit runs up to 24 percent faster than the ARM Mali-G615 MC6 of its predecessor. According to the manufacturer, the energy efficiency of the CPU and GPU has also improved, with 44% and 42% lower power consumption respectively. The MediaTek NPU 880 is used as the AI chip.
In terms of connectivity, dual 5G with a theoretical peak download speed of up to 5.17 GBit/s is available, as well as WiFi 6E and Bluetooth 5.4. Video recording is supported with up to 4K at 60 fps.
The integrated ARM Mali-G720 MC7 graphics unit can control displays with a resolution of up to 2,960 x 1,440 pixels (WQHD+) and a refresh rate of up to 144 Hz.
| Model | Qualcomm Snapdragon 7 Gen 4 SM7750-AB | MediaTek Dimensity 8400 | ||||||||||||
| Series | Qualcomm Snapdragon | |||||||||||||
| Series: Snapdragon |
| |||||||||||||
| Clock | 1800 - 2800 MHz | 2100 - 3250 MHz | ||||||||||||
| Cores / Threads | 8 / 8 1 x 2.8 GHz ARM Cortex-A720 4 x 2.4 GHz ARM Cortex-A720 3 x 1.8 GHz ARM Cortex-A520 | 8 / 8 1 x 3.3 GHz ARM Cortex-A725 3 x 3.0 GHz ARM Cortex-A725 4 x 2.1 GHz ARM Cortex-A725 | ||||||||||||
| Technology | 4 nm | 4 nm | ||||||||||||
| Features | LPDDR5x RAM, UFS 4.0, USB 3.1, Bluetooth 6, GNSS, Wi-Fi 7 | |||||||||||||
| iGPU | Qualcomm Adreno 722 | ARM Mali-G720 MP7 | ||||||||||||
| Architecture | ARM | ARM | ||||||||||||
| Announced | ||||||||||||||
| Manufacturer | www.qualcomm.com | |||||||||||||
| Codename | Cortex-A725 | |||||||||||||
| L2 Cache | 3.5 MB |
Benchmarks
Average Benchmarks Qualcomm Snapdragon 7 Gen 4 SM7750-AB → 100% n=10
Average Benchmarks MediaTek Dimensity 8400 → 124% n=10
* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation
