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LG insists that the problems with Qualcomm's Snapdragon 810 are resolved

LG: Overheating problems resolved, G Flex 2 will arrive on schedule
LG: Overheating problems resolved, G Flex 2 will arrive on schedule
According to the company, the overheating issues are now fixed and the G Flex 2 smartphone powered by Snapdragon 810 will be released on schedule.

During a recent press conference in South Korea focused on Q4 2014 earnings, LG confirmed that there were some overheating issues with Qualcomm's new octa-core Snapdragon 810 SoC. This information sparked a large media response with speculations about possible delays of all major upcoming flagship devices supposed to feature the new chip and hints of Samsung gearing up to use exclusively its own Exynos 7420 SoC for all Galaxy S6 variants. (Previously, Exynos chips were only used in non-US versions of Galaxy S flagships.)

Needless to say, both LG and Qualcomm were far from happy with the impact the issue has made. While Qualcomm is concerned about its reputation and the potential loss of a major customer, LG simply wants to quell the rumors about its new smartphones being delayed, specifically the G Flex 2. The company has now informed the media that the issues were restricted to the initial batch of Snapdragon 810 samples and have been since fixed, claiming that G Flex 2 will be released in March, as originally expected.

Meanwhile, Qualcomm is said to be updating the Snapdragon 810 specifically for Samsung, not willing to part with one of its biggest buyers. Should this prove true, there is a possibility that LG will sue Qualcomm for not providing the G Flex 2 with an updated version of the SoC on the first place. We will be observing the matter closely and will report any important developments as they emerge.

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> Notebook / Laptop Reviews and News > News > News Archive > Newsarchive 2015 01 > LG insists that the problems with Qualcomm's Snapdragon 810 are resolved
Andrey Konstantinov, 2015-01-30 (Update: 2015-01-30)