Deutsch
Español
Français
Italiano
Nederlands
Polski
Português
Русский
Türkçe
Svenska
Chinese
MagyarHiSilicon Kirin 9000 vs HiSilicon Kirin 9000E
HiSilicon Kirin 9000
► remove from comparison
The HiSilicon Kirin 9000 is an ARM based high-end octa-core SoC for smartphones and tablet, which was introduced with the Huawei P40 Pro. It integrates eight CPU cores in three clusters. A single high performance ARM Cortex-A77 cores with up to 3.13 GHz for fast single core performance. Three more performance cores (same Cortex-A77 architecture) with up to 2.54 GHz and four efficiency cores based on the ARM Cortex-A55 architecture with up to 2.05 GHz. All 8 cores can be used at once (big.LITTLE).
The integrated graphics card is using the Mali-G78 architecture and features all 24 cores (G78MP24).
For AI acceleration (NPU), the Kirin 9000 integrates the Da Vinci Architecture 2.0 (2 * Ascend Lite and 1 * Ascend Tiny). Huawei specifies 8 MB of system cache (most likely shared for CPU, GPU and AI) and can access LPDDR4X and LPDDR5 main memory. The integrated 5G modem supports SA&NSA, Sub-6G and mmWave. WiFi 6 including VHT160 and Bluetooth 5.2 are also integrated in the chip.
The CPU performance is in the top tier of mobile SoCs of 2020 and slightly above the Snapdragon 865+ and on a level with the older Apple A13 Bionic SoC.
The Kirin 9000 is produced at TSMC in the modern 5nm process.
HiSilicon Kirin 9000E
► remove from comparisonThe HiSilicon Kirin 9000E is an ARM based high-end octa-core SoC for smartphones and tablet, which was introduced with the Huawei MatePad Pro. It integrates eight CPU cores in three clusters. A single high performance ARM Cortex-A77 cores with up to 3.13 GHz for fast single core performance. Three more performance cores (same Cortex-A77 architecture) with up to 2.54 GHz and four efficiency cores based on the ARM Cortex-A55 architecture with up to 2.05 GHz. All 8 cores can be used at once (big.LITTLE).
The difference to the similar Kirin 9000 is the integrated graphics card, which features only 22 of the 24 clusters (ARM Mali-G78 MP22).
For AI acceleration (NPU), the Kirin 9000 integrates the Da Vinci Architecture 2.0 (2 * Ascend Lite and 1 * Ascend Tiny). Huawei specifies 8 MB of system cache (most likely shared for CPU, GPU and AI) and can access LPDDR4X and LPDDR5 main memory. The integrated 5G modem supports SA&NSA, Sub-6G and mmWave. WiFi 6 including VHT160 and Bluetooth 5.2 are also integrated in the chip.
The CPU performance is in the top tier of mobile SoCs of 2020 and slightly above the Snapdragon 865+ and on a level with the older Apple A13 Bionic SoC.
The Kirin 9000 is produced at TSMC in the modern 5nm process.
| Model | HiSilicon Kirin 9000 | HiSilicon Kirin 9000E | ||||||||||||||||
| Series | ||||||||||||||||||
| Codename | Cortex-A77/-A55 | Cortex-A77/-A55 | ||||||||||||||||
| Series: Cortex-A77/-A55 |
|
| ||||||||||||||||
| Clock | 2050 - 3130 MHz | 2050 - 3130 MHz | ||||||||||||||||
| Cores / Threads | 8 / 8 | 8 / 8 | ||||||||||||||||
| Technology | 5 nm | 5 nm | ||||||||||||||||
| Features | ARM Mali-G78 MP24 GPU, 1x Cortex-A77 (3.13 GHz) + 3x Cortex-A77 (2.54 GHz) + 4 x Cortex-A55 (2.05 GHz, big.LITTLE), 5G SA&NSA, Sub-6G & mmWave, Da Vinci 2.0 AI, Kirin ISP 6.0 | ARM Mali-G78 MP22 GPU, 1x Cortex-A77 (3.13 GHz) + 3x Cortex-A77 (2.54 GHz) + 4 x Cortex-A55 (2.05 GHz, big.LITTLE), 5G SA&NSA, Sub-6G & mmWave, Da Vinci 2.0 AI, Kirin ISP 6.0 | ||||||||||||||||
| iGPU | ARM Mali-G78 MP24 | |||||||||||||||||
| Architecture | ARM | ARM | ||||||||||||||||
| Announced | ||||||||||||||||||
| Manufacturer | www.hisilicon.com | www.hisilicon.com |
- Average benchmark values for this graphics card