To celebrate the launch of Lakefield, Intel sent us an 89-piece Lego set showing off the innards of the hybrid processor. The full details of the groundbreaking 3D micro-architecture can be found via press release here. It may not be 7 nm, but it's a special series nonetheless with significant performance and power-efficiency advantages over the aging Amber Lake-Y series. The first laptops powered by Lakefield are expected to launch in the coming months.
On top of the package die is the compute layer which houses the four low-power Tremont Atom cores and the single, more powerful 10 nm Sunny Cove core derived from Ice Lake. The integrated UHD Graphics sits here as well.
The resulting SoC measures only 12 x 12 x 1 mm to both reduce the space needed on a motherboard and allow for smaller laptop designs.
Explaining advanced micro-architectures with plastic building blocks can only get you so far, but it's definitely a fun and unique approach nonetheless. Hopefully Intel will do the same when Xe graphics cards become available!