Hyundai to follow Apple’s path and develop chips for its cars in-house

Hyundai Mobis, the auto parts subsidiary of Hyundai Motor Group specialising in connected cars, autonomous technology, and electrification, is stepping up its efforts in semiconductor design to boost self-reliance. According to an insider source, the company is aiming for at least 10% of the chips used across Hyundai Motor Group to be developed in-house by 2030, following lessons from the global shortage of automotive semiconductors between 2021 and 2023.

The company is not starting from scratch. Hyundai Mobis has already co-developed 16 system semiconductors with partners and manufactures around 20 million units annually. It also operates six production lines producing seven power module models. Over the next two to three years, the supplier plans to release ten new chips, with CEO Lee Gyu-suk highlighting the need for a long-term strategy to reduce dependence on foreign vendors.

Hyundai Mobis is pursuing a hybrid model that combines in-house design with extensive collaboration across South Korea’s semiconductor ecosystem. The company has confirmed that it will work with Samsung Foundry, LX Semicon, Cadence, Synopsys, and ADT on a network SoC that it designed internally and will verify itself. Other projects include a body-control chip integrating five functions, due in 2026, developed with Dongwoon Anatech, DB Hitek, and ASE Korea, as well as a smart LED solution co-created with Global Technology, SK Key Foundry, and Dongbu LED.

Looking ahead, Hyundai Mobis plans to begin producing power management ICs with its partners and is targeting the launch of a silicon IGBT (Si-IGBT) in 2026. The company says this approach will not only strengthen Hyundai Motor Group’s supply chain resilience but also support growth across South Korea’s automotive and semiconductor industries.