Mediatek Helio P70 vs MediaTek Dimensity 7020 vs MediaTek Dimensity 1100

Mediatek Helio P70

The Mediatek Helio P70 is an upper mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2019. It is manufactured in a 12 nm FinFET (12FFC) process and is equipped with 4x big ARM Cortex-A73 cores and 4x small and power efficient ARM Cortex-A53 cores in two clusters (bigLITTLE). The cores can reach a frequency of up to 2.1 GHz. The processor also integrates a ARM Mali-G72MP3 GPU and a dedicated AI processing unit. Compared to the older Helio P60, the P70 uses the same silicon (most likely) but 100 MHz higher clocked CPU and GPU cores.

MediaTek Dimensity 7020

The Mediatek Dimensity 7020 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a IMG BXM-8-256 GPU, a Wi-Fi 5 modem, a LPDDR5 / LPDDR4X memory controller, a AI processing unit  and video de- and encoding.

The 5G modem supports NR 2CC and mixed duplex (TDD/FDD) and dual SIM. The download speeds can reach up to 2.77 Gbit/s.

Compared to the Dimensity 930, the 7020 offers the same specifications and seems to be a rebrand.

The Dimensity 930 and 7020 are manufactured in the modern 6nm process and should be very power efficient.

MediaTek Dimensity 1100

The Mediatek Dimensity 1100 is a fast mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A78 cores at up to 2.6 GHz and four power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 9 core ARM Mali-G77 MC9 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller, a AI processing unit (APU 3.0 with 6 cores) and video de- and encoding. As one of the first SoCs, the Dimensity 1000 series offers AV1 hardware decoding. The chip is manufactured in the modern 7nm process and should be very power efficient.