MediaTek Dimensity 9000+ vs MediaTek Dimensity 8200-Ultra vs MediaTek Dimensity 7020

MediaTek Dimensity 9000+

The MediaTek Dimensity 9000+ (or 9000 Plus) is a high-end SoC with an integrated 5G modem. It includes one fast Cortex-X2 core with up to 3 GHz, three more A710 cores with up to 2.85 GHz and four power efficiency cores (Cortex-A510) with upto 1.8 GHz. The SoC is manufactured in the new 4nm process at TSMC. All CPU cores can together use 8 MB of level 3 cache and 6 MB of System Level Cache (SLC). Compared to the similar Dimensity 9000, the 9000 Plus offers a 200 MHz higher clocked X2 core.

The CPU Performance of the 9000+ is very good thanks to the big cores and high clock speeds. At the time of announcement, it should be the fastest SoC for Android phones and depending on the workload even best the Apple A15 of the iPhone 13 (e.g. Geekbench in Multi-Core tests). The Snapdragon 8+ Gen 1 (in the ROG Phone 6 Pro e.g.) should slightly behind the Dimensity 9000+ in single and multi-threaded tests.

The integrated quad channel memory controller supports LPDDR5X with 7500 Mbps. The integrated GPU is an ARM Mali-G710 MC10 (10 of the 16 possible cores) and should be 10% faster compared to the same iGPU in the Dimensity 9000 (thanks to higher clocks).

The Dimensity 9000+ is produced in the state of the art 4nm process at TSMC.

MediaTek Dimensity 8200-Ultra

The MediaTek Dimensity 8200-Ultra is a upper mid-range ARM-based SoC (system-on-a-chip) that is manufactured using the modern 4 nm process. It was specially designed for use in Android smartphones and is in the upper class in terms of performance. It supports all current mobile communication standards, including 5G SA. 

The CPU works with a total of eight cores, which are divided into two clusters. In the first cluster, an ARM Cortex-A78 power core clocked at 3.1 GHz is joined by three further ARM Cortex-A78 power cores clocked at 3 GHz. In the second cluster, four ARM Cortex-A55 power cores operate at 2.0 GHz. LPDDR5 RAM can be used as RAM and UFS 3.1 is supported as internal memory. 

In terms of connectivity, dual 5G with a theoretical peak download speed of up to 4.7 GBit/s is available, as well as WiFi 6E and Bluetooth 5.3.

The Mediatek Dimensity 8200-Ultra is a variant of the otherwise identical Mediatek Dimensity 8200 that has been specially customised for Xiaomi and features improvements to the camera ISP. An Imagiq 785 image processor is responsible for processing the camera data. Video recordings are supported with up to 4K at 60 fps. The CPU part of the older Dimensity 8100 is very similar and offers the same CPU and GPU cores.

The integrated ARM Mali-G610 MC6 graphics unit can power displays with a resolution of up to 2,960 x 1,440 pixels (WQHD+) and a refresh rate of up to 120 Hz. With Full HD+, even up to 180 Hz is possible.

MediaTek Dimensity 7020

The Mediatek Dimensity 7020 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a IMG BXM-8-256 GPU, a Wi-Fi 5 modem, a LPDDR5 / LPDDR4X memory controller, a AI processing unit  and video de- and encoding.

The 5G modem supports NR 2CC and mixed duplex (TDD/FDD) and dual SIM. The download speeds can reach up to 2.77 Gbit/s.

Compared to the Dimensity 930, the 7020 offers the same specifications and seems to be a rebrand.

The Dimensity 930 and 7020 are manufactured in the modern 6nm process and should be very power efficient.