MediaTek Dimensity 8200-Ultra vs Qualcomm Snapdragon 888 Plus 5G vs MediaTek Dimensity 1100

MediaTek Dimensity 8200-Ultra

The MediaTek Dimensity 8200-Ultra is a upper mid-range ARM-based SoC (system-on-a-chip) that is manufactured using the modern 4 nm process. It was specially designed for use in Android smartphones and is in the upper class in terms of performance. It supports all current mobile communication standards, including 5G SA. 

The CPU works with a total of eight cores, which are divided into two clusters. In the first cluster, an ARM Cortex-A78 power core clocked at 3.1 GHz is joined by three further ARM Cortex-A78 power cores clocked at 3 GHz. In the second cluster, four ARM Cortex-A55 power cores operate at 2.0 GHz. LPDDR5 RAM can be used as RAM and UFS 3.1 is supported as internal memory. 

In terms of connectivity, dual 5G with a theoretical peak download speed of up to 4.7 GBit/s is available, as well as WiFi 6E and Bluetooth 5.3.

The Mediatek Dimensity 8200-Ultra is a variant of the otherwise identical Mediatek Dimensity 8200 that has been specially customised for Xiaomi and features improvements to the camera ISP. An Imagiq 785 image processor is responsible for processing the camera data. Video recordings are supported with up to 4K at 60 fps. The CPU part of the older Dimensity 8100 is very similar and offers the same CPU and GPU cores.

The integrated ARM Mali-G610 MC6 graphics unit can power displays with a resolution of up to 2,960 x 1,440 pixels (WQHD+) and a refresh rate of up to 120 Hz. With Full HD+, even up to 180 Hz is possible.

Qualcomm Snapdragon 888 Plus 5G

The Qualcomm Snapdragon 888+ (Plus) 5G Mobile Platform is a high-end SoC for smartphones that was introduced in mid 2021 and manufactured in 5 nm at Samsung. 

Integrates one “Prime Core” based on a ARM Cortex-X1 architecture clocked at up to 3 GHz. Three more performance cores are based on the A78 but clock up to 2.42 GHz. Furthermore, four energy saving cores are integrated that are based on the ARM Cortex-A55 architecture and clock at up to 1.8 GHz. In addition to the processor cores, the SoC integrates a WiFi 6e modem, a Hexagon 780 DSP (up to 26 TOPS of AI performance) and a Spectra 580 ISP. The integrated memory controller now supports faster LPDDR5 memory with up to 3,200 MHz. 5G is now included in the chip with the Snapdragon X60 modem.

Compared to the older Snapdragon 888, the 888+ offers a slightly higher clocked prime core (+160 MHz) and a 23% faster Hexagon 790 DSP. Therefore, it is now the fastest Android SoC (at the time of announcement), but still slightly slower (CPU and GPU) than the Apple A14 and A15 Bionic SoCs.

MediaTek Dimensity 1100

The Mediatek Dimensity 1100 is a fast mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A78 cores at up to 2.6 GHz and four power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 9 core ARM Mali-G77 MC9 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller, a AI processing unit (APU 3.0 with 6 cores) and video de- and encoding. As one of the first SoCs, the Dimensity 1000 series offers AV1 hardware decoding. The chip is manufactured in the modern 7nm process and should be very power efficient.