MediaTek Dimensity 8200-Ultra vs MediaTek Dimensity 8050 vs MediaTek Dimensity 7050

MediaTek Dimensity 8200-Ultra

The MediaTek Dimensity 8200-Ultra is a upper mid-range ARM-based SoC (system-on-a-chip) that is manufactured using the modern 4 nm process. It was specially designed for use in Android smartphones and is in the upper class in terms of performance. It supports all current mobile communication standards, including 5G SA. 

The CPU works with a total of eight cores, which are divided into two clusters. In the first cluster, an ARM Cortex-A78 power core clocked at 3.1 GHz is joined by three further ARM Cortex-A78 power cores clocked at 3 GHz. In the second cluster, four ARM Cortex-A55 power cores operate at 2.0 GHz. LPDDR5 RAM can be used as RAM and UFS 3.1 is supported as internal memory. 

In terms of connectivity, dual 5G with a theoretical peak download speed of up to 4.7 GBit/s is available, as well as WiFi 6E and Bluetooth 5.3.

The Mediatek Dimensity 8200-Ultra is a variant of the otherwise identical Mediatek Dimensity 8200 that has been specially customised for Xiaomi and features improvements to the camera ISP. An Imagiq 785 image processor is responsible for processing the camera data. Video recordings are supported with up to 4K at 60 fps. The CPU part of the older Dimensity 8100 is very similar and offers the same CPU and GPU cores.

The integrated ARM Mali-G610 MC6 graphics unit can power displays with a resolution of up to 2,960 x 1,440 pixels (WQHD+) and a refresh rate of up to 120 Hz. With Full HD+, even up to 180 Hz is possible.

MediaTek Dimensity 8050

The MediaTek Dimensity 8050 is an ARM-based SoC (System-on-a-Chip) manufactured at TSMC using the 6nm process.  It supports all current mobile standards including dual-SIM 5G (5G SA & NSA, max 4.7 Gbps download and 2.5 Gbps upload). The SoC also supports Wi-Fi 6 and Bluetooth 5.2.

The MediaTek Dimensity 8050 was specially designed for use in Android smartphones and is classified in the upper mid-range in terms of performance.

The CPU part consists of three clusters: a fast performance core, based on the ARM Cortex A78 architecture and clocked at up to 3 GHz. The second cluster consists of three Cortex-A78 cores with up to 2.6 GHz. Four ARM Cortex-A55 cores with up to 2 GHz are installed as a power-saving cluster.

The integrated ARM Mali-G77 MC9 graphics unit can drive displays with a resolution of up to 2,560 x 1,080 and a refresh rate of up to 144 Hz (possibly only with Full HD+).

Technically, the SoC is similar to the older Dimensity 1300.

MediaTek Dimensity 7050

The Mediatek Dimensity 7050 (Mediatek MT8791N/TN)  is a mid-range ARM SoC (system-on-a-chip) that can be used in both smartphones and tablets (mainly Android). The SoC integrates two ARM Cortex-A78 cores with up to 2.6 GHz for demanding tasks and six power-saving ARM Cortex-A55 cores with clock rates of up to 2 GHz. The specifications are identical to the old Dimensity 1080.

The chip has an integrated sub-6 GHz 5G modem including dual-SIM support that can reach a maximum download speed of up to 2.77 Gbit/s. Wi-Fi 6 (802.11ax) is supported as well as Bluetooth 5.2.

The memory controller copes with LPDDR4x or LPDDR5 working memory as well as UFS 3.1 mass storage. As an integrated graphics card, the SoC uses the ARM Mali-G68 MC4, which supports displays with 120 Hz as well as HDR10+ at a maximum resolution of 2,520 x 1,440 pixels.

The MediaTek Dimensity 7050 is still manufactured in 6 nm.