MediaTek Dimensity 8200-Ultra vs MediaTek Dimensity 8050 vs MediaTek Dimensity 7020

MediaTek Dimensity 8200-Ultra

The MediaTek Dimensity 8200-Ultra is a upper mid-range ARM-based SoC (system-on-a-chip) that is manufactured using the modern 4 nm process. It was specially designed for use in Android smartphones and is in the upper class in terms of performance. It supports all current mobile communication standards, including 5G SA. 

The CPU works with a total of eight cores, which are divided into two clusters. In the first cluster, an ARM Cortex-A78 power core clocked at 3.1 GHz is joined by three further ARM Cortex-A78 power cores clocked at 3 GHz. In the second cluster, four ARM Cortex-A55 power cores operate at 2.0 GHz. LPDDR5 RAM can be used as RAM and UFS 3.1 is supported as internal memory. 

In terms of connectivity, dual 5G with a theoretical peak download speed of up to 4.7 GBit/s is available, as well as WiFi 6E and Bluetooth 5.3.

The Mediatek Dimensity 8200-Ultra is a variant of the otherwise identical Mediatek Dimensity 8200 that has been specially customised for Xiaomi and features improvements to the camera ISP. An Imagiq 785 image processor is responsible for processing the camera data. Video recordings are supported with up to 4K at 60 fps. The CPU part of the older Dimensity 8100 is very similar and offers the same CPU and GPU cores.

The integrated ARM Mali-G610 MC6 graphics unit can power displays with a resolution of up to 2,960 x 1,440 pixels (WQHD+) and a refresh rate of up to 120 Hz. With Full HD+, even up to 180 Hz is possible.

MediaTek Dimensity 8050

The MediaTek Dimensity 8050 is an ARM-based SoC (System-on-a-Chip) manufactured at TSMC using the 6nm process.  It supports all current mobile standards including dual-SIM 5G (5G SA & NSA, max 4.7 Gbps download and 2.5 Gbps upload). The SoC also supports Wi-Fi 6 and Bluetooth 5.2.

The MediaTek Dimensity 8050 was specially designed for use in Android smartphones and is classified in the upper mid-range in terms of performance.

The CPU part consists of three clusters: a fast performance core, based on the ARM Cortex A78 architecture and clocked at up to 3 GHz. The second cluster consists of three Cortex-A78 cores with up to 2.6 GHz. Four ARM Cortex-A55 cores with up to 2 GHz are installed as a power-saving cluster.

The integrated ARM Mali-G77 MC9 graphics unit can drive displays with a resolution of up to 2,560 x 1,080 and a refresh rate of up to 144 Hz (possibly only with Full HD+).

Technically, the SoC is similar to the older Dimensity 1300.

MediaTek Dimensity 7020

The Mediatek Dimensity 7020 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a IMG BXM-8-256 GPU, a Wi-Fi 5 modem, a LPDDR5 / LPDDR4X memory controller, a AI processing unit  and video de- and encoding.

The 5G modem supports NR 2CC and mixed duplex (TDD/FDD) and dual SIM. The download speeds can reach up to 2.77 Gbit/s.

Compared to the Dimensity 930, the 7020 offers the same specifications and seems to be a rebrand.

The Dimensity 930 and 7020 are manufactured in the modern 6nm process and should be very power efficient.