MediaTek Dimensity 7050 vs MediaTek MT8188J vs MediaTek Dimensity 1300

MediaTek Dimensity 7050

The Mediatek Dimensity 7050 (Mediatek MT8791N/TN)  is a mid-range ARM SoC (system-on-a-chip) that can be used in both smartphones and tablets (mainly Android). The SoC integrates two ARM Cortex-A78 cores with up to 2.6 GHz for demanding tasks and six power-saving ARM Cortex-A55 cores with clock rates of up to 2 GHz. The specifications are identical to the old Dimensity 1080.

The chip has an integrated sub-6 GHz 5G modem including dual-SIM support that can reach a maximum download speed of up to 2.77 Gbit/s. Wi-Fi 6 (802.11ax) is supported as well as Bluetooth 5.2.

The memory controller copes with LPDDR4x or LPDDR5 working memory as well as UFS 3.1 mass storage. As an integrated graphics card, the SoC uses the ARM Mali-G68 MC4, which supports displays with 120 Hz as well as HDR10+ at a maximum resolution of 2,520 x 1,440 pixels.

The MediaTek Dimensity 7050 is still manufactured in 6 nm.

MediaTek MT8188J

The MediaTek MT8188J is a mid-range ARM SoC (System-on-a-Chip) introduced in the first quarter of 2023, primarily used in Android-based tablets. It is manufactured using a 12-nanometer process and features a total of eight CPU cores (Octa-Core). These consist of two fast Cortex-A78 cores and 6 Cortex-A55 cores that work together in a big.LITTLE configuration.

The A78 cores of the MediaTek MT8188J can clock at speeds of up to 2.2 GHz, while the A55 cores can reach speeds of up to 2 GHz (going down to 500 MHz). For graphics processing, it employs an ARM Mali-G57 MP2 GPU. Additionally, it includes a video decoder with support for H.264 and H.265.

In addition to the CPU and GPU, the chip integrates an LPDDR4 memory controller, capable of supporting up to 8 GB of RAM. The SoC also includes a modem for WiFi 6, Bluetooth 5.3, and LTE up to Cat.7.

MediaTek Dimensity 1300

The Mediatek Dimensity 1300 is a high-end SoC with an integrated 5G modem. It includes three CPU clusters. One fast ARM Cortex-A78 at up to 3 GHz with 2x L2 cache, 3 additional A78 with up to 2.6 GHz and for power efficiency four ARM Cortex-A55 cores at up to 2 GHz. The SoC looks to be identical to the older Dimensity 1200.

Furthermore, the chip integrates a 9 core ARM Mali-G77 MC9 GPU, a Wi-fi 6 modem (ax), a LPDDR4x memory controller (up to 5266Mbps), a AI processing unit (APU 3.0 with 6 cores) and video de- and encoding (including AV1).

The chip is manufactured in the modern 6nm process and should be very power efficient.