MediaTek Dimensity 7030 vs Samsung Exynos 9810 vs MediaTek Dimensity 7050

MediaTek Dimensity 7030

The Mediatek Dimensity 7030 is a mid-range ARM SoC (system-on-a-chip) that can be used in both smartphones and tablets (mainly Android). The SoC was introduced in September 2023.

It includes a 5G modem and supports the latest mobile phone standards in dual-SIM mode with both cards, so that surfing and phoning is possible via two different cards at the same time. The SoC integrates two ARM Cortex A78 cores with up to 2.5 GHz for demanding tasks and six low-power ARM Cortex A55 cores with clock speeds of up to 2 GHz.

The chip has an integrated sub-6 GHz and mmWave 5G modem including dual-SIM support that can reach a maximum download speed of up to 4.6 Gbps. Wi-Fi 6E (802.11ax) is supported as well as Bluetooth 5.2. 

The memory controller can cope with LPDDR4x or LPDDR5 working memory as well as UFS 3.1 mass storage. As an integrated graphics card, the SoC uses the Mali-G610 MP3, which supports displays with 144 Hz as well as HDR10+ Adaptive, HLG and Dolby Vision at a maximum resolution of 2,520 x 1,080 pixels.

Compared to the Dimensity 920, the CPU unit has the same clock speeds but a more modern instruction set, ARMv8.2-A. A new graphics unit is used and WiFi 6E is supported, as well as displays with up to 144 Hz.

The SoC is manufactured in a 6nm process.

Samsung Exynos 9810

The Samsung Exynos 9 9810 is a mobile SoC for smartphones and tablets. It was announced early 2018 and should be integrated in the upcoming Samsung Galaxy S9 series (at least partly). It integrates eight CPU cores (octa core) in two clusters. The performance cluster integrates four Samsung M3 at 2.9 GHz and the power efficiency cluster four small ARM Cortex-A55 cores at 1.9 GHz. The Samsung M3 cores are based on Samsungs own design and now offer a wider pipeline, improved cache memory and bigger caches. This leads to a twice as fast single-core performance and a 40 percent improved multi-core performance according to Samsung (most likely compared to the previous Exynos 8898).

The integrated LTE modem also got a siginifcant upgrade and now supports Cat.18/13 LTE for up to 1.2 Gbps download and 200 Mbps upload. This is achieved with 6x20 MHz CA, 256-QAM in download and 2x20 MHz in upload.

As a GPU, Samsung integrates a ARM Mali G72MP18 (only 18 clusters, compared to the 20 clusters of the predecessor G71MP20). Most likely Samsung increases performance due to a higher core clock of the graphics card.

The memory controller looks similar to the 8898 and supports LPDDR4x 1800 MHz. The video engine now also supports 10 bit videos (as before 4k120 H.265/HEVC, H.264 and VP9 de- and encoding). 

The SoC is produced at Samsung in the new 10nm LPP process (the Exynos 8898 still used the 10nm LPE process) that should also help with some of the performance gains.

MediaTek Dimensity 7050

The Mediatek Dimensity 7050 (Mediatek MT8791N/TN)  is a mid-range ARM SoC (system-on-a-chip) that can be used in both smartphones and tablets (mainly Android). The SoC integrates two ARM Cortex-A78 cores with up to 2.6 GHz for demanding tasks and six power-saving ARM Cortex-A55 cores with clock rates of up to 2 GHz. The specifications are identical to the old Dimensity 1080.

The chip has an integrated sub-6 GHz 5G modem including dual-SIM support that can reach a maximum download speed of up to 2.77 Gbit/s. Wi-Fi 6 (802.11ax) is supported as well as Bluetooth 5.2.

The memory controller copes with LPDDR4x or LPDDR5 working memory as well as UFS 3.1 mass storage. As an integrated graphics card, the SoC uses the ARM Mali-G68 MC4, which supports displays with 120 Hz as well as HDR10+ at a maximum resolution of 2,520 x 1,440 pixels.

The MediaTek Dimensity 7050 is still manufactured in 6 nm.