MediaTek Dimensity 7025 vs Qualcomm Snapdragon 6 Gen 3
MediaTek Dimensity 7025
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The Mediatek Dimensity 7025 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores running at up to 2.5 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (octa-core chip with Heterogeneous Multi-Processing). Furthermore, the chip integrates an IMG BXM-8-256 GPU, a Wi-Fi 5 modem, an LPDDR5 / LPDDR4X memory controller, an AI processing unit and hardware video de- and encoding.
The 5G modem supports NR 2CC and mixed duplex (TDD/FDD) and is dual-SIM-compatible. The max download speed reachable is 2.77 Gbit/s.
Compared to the Dimensity 7020, the 7025 has a higher clock speed on the "big" A78 cores.
The Dimensity 7025 is manufactured on 6nm at TSMC.
Qualcomm Snapdragon 6 Gen 3
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The Qualcomm Snapdragon 6 Gen 3 (SM6475-AB) is an ARM-based SoC for smartphones and tablets in the mid-range segment. The chip was presented in late 2024 and offers four fast ARM Cortex-A78-based cores with up to 2 GHz and four ARM Cortex-A55-based power cores with up to 1.8 GHz. Except for the higher clock rate of the Cortex-A78 cores, the SoC corresponds to the older Snapdragon 6 Gen 1.
As expected, the performance is only a few percentage points above the old Snapdragon 6 Gen 1 and therefore in the lower mid-range of current smartphone processors.
The integrated graphics card is the Adreno 710. The 5G modem achieves a maximum download speed of 2.9 GBit and supports mmWave. The FastConnect subsystem offers Bluetooth 5.2 LE and Wi-Fi 6E. All important satellite positioning systems such as GPS, QZSS, NavIC, GLONASS, Beidou and Galileo are supported. The image signal processor for the cameras supports 3 cameras. Up to 200 megapixels are possible with the main camera and the recording of images in HEIC format is supported.
The Qualcomm Snapdragon 6 Gen 3 is manufactured using 4 nm technology.
Model | MediaTek Dimensity 7025 | Qualcomm Snapdragon 6 Gen 3 | ||||||||
Codename | Cortex-A78 / A55 | Cortex-A78 / A55 | ||||||||
Clock | 2000 - 2500 MHz | 1800 - 2400 MHz | ||||||||
Cores / Threads | 8 / 8 2 x 2.5 GHz ARM Cortex-A78 6 x 2.0 GHz ARM Cortex-A55 | 8 / 8 4 x 2.4 GHz ARM Cortex-A78 4 x 1.8 GHz ARM Cortex-A55 | ||||||||
Technology | 6 nm | 4 nm | ||||||||
Features | PowerVR BXM-8-256, 5G 2CC-CA FDD+TDD, Dual 5G SIM, Dual VoNR, UFS 3.1, LPDDR5 | Spectra Triple ISP, AI Engine, Wi-Fi 6E, 5G Modem | ||||||||
iGPU | IMG BXM-8-256 | Qualcomm Adreno 710 | ||||||||
Architecture | ARM | ARM | ||||||||
Announced | ||||||||||
Manufacturer | www.mediatek.com | www.qualcomm.com | ||||||||
Series | Qualcomm Snapdragon 6 | |||||||||
Series: Snapdragon 6 Cortex-A78 / A55 |
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Benchmarks
Average Benchmarks MediaTek Dimensity 7025 → 100% n=20
Average Benchmarks Qualcomm Snapdragon 6 Gen 3 → 118% n=20

* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation