iPhone 18 Pro and iPhone Fold rumored to get performance boost from 2nm Apple A20 SoC with integrated RAM

While the iPhone 17 Pro and iPhone 17 Pro Max are expected to feature the Apple A19 processor, which will likely use TSMC's N3P process, analyst Jeff Pu now suggests that the Apple A20 will be manufactured in a new 2-nanometer process, specifically TSMC's N2 process. This improvement alone could make the chipset up to 15% more powerful and 30% more efficient, even without factoring in potential architectural changes.

The second significant upgrade for the Apple A20 could be the so-called advanced Wafer-Level Multi-Chip Module (WMCM) packaging process. In layman’s terms, this integrates the memory directly into the chip, rather than using separate RAM modules on the mainboard. While this design is more expensive, it could lead to significantly higher memory bandwidth and slightly lower power consumption. According to Jeff Pu, this approach would also save a small amount of space on the mainboard and potentially allow Apple to fit a slightly larger battery.

Either way, the Apple A20 SoC is expected to debut in the iPhone 18 Pro, iPhone 18 Pro Max and iPhone 18 Fold, which will likely be unveiled in September 2026. As is typical with early rumors, these details and claims should be taken with a grain of salt. Apple’s plans might change if TSMC cannot meet its timeline for the N2 mass production, for instance. Also, the base models of Apple’s upcoming smartphones are expected to be equipped with last-gen chips in order to keep prices low.