Qualcomm Snapdragon 6s Gen 3 vs Unisoc T8100 (T760) vs MediaTek Dimensity 700

Qualcomm Snapdragon 6s Gen 3

Unisoc T8100 (T760)

The Unisoc T8100 (previously known as the Unisoc T760) is a mid range SoC for Android based smartphones and tablets. It integrates an octa-core CPU with two clusters. Four fast ARM Cortex-A76 cores clocked at up to 2 GHz and four small ARM-Cortex-A55 cores at again up to 2 GHz for efficiency. The faster T770 SoC offers higher clocked A76 cores in comparison (up to 2.5 GHz for a single core).

One fast ARM Cortex-A76 clocked at up to 2.5 GHz, three more A76 performance cores clocked at up to 2.2 GHz and a power efficiency cluster of four ARM-Cortex-A55 cores with up to 2 GHz. The integrated memory controller supports LPDDR4/4X with up to 2133 MHz (2x 16 Bit). The integrated ISP supports two main cameras and two subsidiary cameras (up to 108 MPix). The integrated graphics card is an ARM Mali-G57 MC4 (4 cores) at up to 780 MHz.

The chip is manufactured on the modern 6nm process.

MediaTek Dimensity 700

The Mediatek Dimensity 700 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Compared to the similar Dimensity 800U, the 700 offers lower clocked CPU cores (-200 MHz) and a slower GPU (one less core).

Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x-2133 memory controller, a AI processing unit (APU 3.0) and video de- and encoding.

The Dimensity 700 is manufactured in the modern 7nm process and should be very power efficient.