AMD Ryzen AI 5 PRO 435 vs AMD Ryzen AI 5 430
AMD Ryzen AI 5 PRO 435
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The AMD Ryzen AI 5 PRO 435 or AI 5 H PRO 435 is a mid-range mobile processor from the Gorgon Point family that was announced at CES in Jan 2026. The laptop APU features 6 CPU cores (2x Zen 5 with up to 4.5 GHz, 4x Zen 5c with less cache and a 3.4 GHz maximum clock speed), a Radeon 840M iGPU and a 50-TOPS NPU, and is similar to the older AMD Ryzen AI 5 PRO 340 (3x Zen 5 at up to 4.8 GHz, 3x Zen 5c at up to 3.4 GHz, Radeon 840M iGPU, 50-TOPS NPU).
Compared to the consumer Ryzen AI 5 435, the PRO variant offers additional management and security features like support for ECC RAM. The China-targeted H version may have a set of hardware-accelerated cryptographic features different to the global chip.
Architecture and features
Gorgon / Krackan Point family APUs are powered by Zen 5 and Zen 5c microarchitecture cores, the latter being a slightly slower, smaller and more energy-efficient version of the former. One of the key differences between the two is, Zen 5 cores have larger caches to play with.
The mobile Zen 5 implementation is reportedly (ChipsAndCheese) closer to desktop Zen 4 than desktop Zen 5 due to the different cache sizes, AVX512 throughput, and other factors.
Elsewhere, the Ryzen AI 5 chip supports DDR5-5600 and LPDDR5x-8000 RAM, giving system designers a choice between lower latency and higher throughput. The APU is natively compatible with USB 4 (and therefore Thunderbolt). It has PCIe 4.0 support for a throughput of 1.9 GB/s per lane, just like its 300-series predecessors. The integrated XDNA 2 NPU delivers up to 50 INT8 TOPS for accelerating various AI workloads.
As usual with laptop CPUs, the Ryzen AI 5 PRO cannot be replaced by the user as it is soldered-in.
The 4 nm TSMC process these CPUs are manufactured with ensures average energy efficiency, as of early 2026.
CPU performance
Given the specs similarity, the PRO 435 should be just slightly slower than the outgoing AMD Ryzen AI 5 340 (or the AI 5 PRO 340) putting it in the same ballpark as the Ryzen 7 8840U, Core Ultra 7 256V and Core Ultra 7 258V.
GPU performance
The Radeon 840M only has a quarter of the Radeon 890M's Compute Units, so just 4 (meaning, 256 unified shaders). It runs at up to 2.9 GHz and isn't powerful enough for anything resembling serious 1080p or even 720p gaming, as of Jan 2026. Hardware AV1, VP9, HEVC and AVC decoding is supported, as are 8K 4320p monitors.
Power consumption
The 435 has a recommended base TDP of 28 watts, making this a P-class chip, although laptop manufacturers are free to set the value to anything between 15 and 54 W.
AMD Ryzen AI 5 430
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The AMD Ryzen AI 5 430 or AMD Ryzen AI 5 H 430 is a lower-end processor from the Gorgon Point family. Unveiled in Jan 2026, the laptop APU sports 4 CPU cores (1x Zen 5 with up to 4.5 GHz and 3x Zen 5c with less cache and up to 3.4 GHz), a 50-TOPS NPU and a moderate RDNA 3.5 iGPU.
This new APU is quite similar to the Ryzen AI 5 330 from mid-2025, with the latter's slower iGPU being the main difference.
The China-targeted H version may have a set of hardware-accelerated cryptographic features different to the global chip.
Architecture and features
Gorgon Point family APUs are powered by Zen 5 and Zen 5c cores, the latter being a slightly slower, smaller and more energy efficient version of the former. One of the differences between Zen 5 and Zen 5c is the size of their caches, with the latter having less.
The mobile Zen 5 implementation is reportedly (ChipsAndCheese) closer to desktop Zen 4 than desktop Zen 5 due to differences in cache sizes, AVX512 throughput and other factors.
Elsewhere, the Ryzen AI 5 chip supports DDR5-5600 and LPDDR5x-8000 RAM, giving system designers a choice between lower latency and higher throughput. The chip is natively compatible with USB 4 (and therefore Thunderbolt). It has PCIe 4.0 support for a throughput of 1.9 GB/s per lane, just like its 300 series predecessors.
As usual with laptop CPUs, the Ryzen 5 AI chip cannot be replaced by the user down the line as it is soldered-in.
While not cutting-edge, the 4 nm TSMC process which the APU is manufactured on ensures decent energy efficiency, as of early 2026.
CPU performance
Due to having the same CPU specifications, the Ryzen AI 5 430 should offer the same performance as the older Ryzen AI 5 330, putting it close to the Ryzen 5 5600U, Core i7-1195G7, Core Ultra 7 164U.
GPU performance
The Radeon 840M only has a quarter of the Radeon 890M's 16 CUs (so 4 CUs, or 256 shaders) and runs at up to 2.8 GHz. It is not fast enough to run AAA 2025 games, even at resolutions like HD 720p with quality set to Low. Hardware AV1, VP9, HEVC and AVC decoding is supported, as are 8K 4320p monitors.
Power consumption
The Ryzen has a recommended base of 15 to 28 watts TDP that computer makers are free to adjust to their needs.
| Model | AMD Ryzen AI 5 PRO 435 | AMD Ryzen AI 5 430 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Codename | Gorgon Point | Gorgon Point | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Series | AMD Strix / Gorgon Point | AMD Strix / Gorgon Point | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Series: Strix / Gorgon Point Gorgon Point |
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| Clock | 2000 - 4500 MHz | 2000 - 4500 MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| L2 Cache | 6 MB | 4 MB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| L3 Cache | 8 MB | 8 MB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Cores / Threads | 6 / 12 2 x 4.5 GHz AMD Zen 5 4 x 3.4 GHz AMD Zen 5c | 4 / 8 1 x 4.5 GHz AMD Zen 5 3 x 3.4 GHz AMD Zen 5c | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TDP | 28 Watt | 28 Watt | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Technology | 4 nm | 4 nm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| max. Temp. | 100 °C | 100 °C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Socket | FP8 | FP8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Features | DDR5-5600/LPDDR5x-8000 RAM, PCIe 4, USB 4, XDNA 2 NPU (50 TOPS), Secure Processor, SMT, MMX, SSE, SSE2, SSE3, SSSE3, SSE4A, SSE4.1, SSE4.2, AVX, AVX2, AVX512, BMI2, ABM, FMA, ADX, SMEP, SMAP, CPB, AES-NI, RDRAND, RDSEED, SHA, SME | DDR5-5600/LPDDR5x-8000 RAM, PCIe 4, USB 4, XDNA 2 NPU (50 TOPS), SMT, MMX (+), SSE, SSE2, SSE3, SSSE3, SSE4A, SSE4.1, SSE4.2, AVX, AVX2, AVX512, BMI2, ABM, FMA, ADX, SMEP, SMAP, CPB, AES-NI, RDRAND, RDSEED, SHA, SME | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| iGPU | AMD Radeon 840M ( - 2800 MHz) | AMD Radeon 840M ( - 2800 MHz) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NPU / AI | 50 TOPS INT8 | 50 TOPS INT8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Chip AI | 59 TOPS INT8 | 58 TOPS INT8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Architecture | x86 | x86 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Announced | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Manufacturer | www.amd.com | www.amd.com |
Benchmarks
Average Benchmarks AMD Ryzen AI 5 430 → 0% n=0
- Average benchmark values for this graphics card* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation
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