Mediatek Helio G100 vs Qualcomm Snapdragon 8s Gen 3
Mediatek Helio G100
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The MediaTek Helio G100 is an entry level ARM SoC (system-on-a-chip) that can be used in both smartphones and tablets (mainly Android). Technically comparable to the older Mediatek Helio G99 but with support for up to 200 MP main cameras.
The SoC integrates two ARM Cortex-A76 cores with up to 2.2 GHz for demanding tasks and six small ARM Cortex-A55 cores with up to 2 GHz clock speed in a power-saving cluster.
The integrated 4G LTE modem supports Cat-13 (400 Mbps download, 150 Mbps upload). Wi-Fi 5 (a/b/g/n/ac) is also on board. The memory controller supports LPDDR4x RAM with up to 4266 MHz.
A maximum of UFS 2.2 memory can be used for mass storage.
The MediaTek Helio G100 is manufactured using the 6nm process.
Qualcomm Snapdragon 8s Gen 3
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The Snapdragon 8s Gen 3 (SM8635) is a high-end SoC (system-on-a-chip) that can be used in premium smartphones and tablets (mostly Android based).
In terms of performance, it is between Snapdragon 8 Gen 2 and Snapdragon 8 Gen 3 and is based on ARM's v9.2 architecture.
The Kryo CPU consists of three clusters: the first consists of a prime core (Cortex X4) with up to 3 GHz, the second of four performance cores with up to 2.8 GHz (Cortex A720). The efficiency cluster consists of three power-saving units (Cortex A520) operating at up to 2 GHz. The SoC uses the integrated Qualcomm Adreno 735 iGPU for graphics acceleration.
Qualcomm's AI engine supports multimodal generative AI models, including LLM, LVM and ASR, and can process up to 10 trillion parameters directly on the SoC. Image manipulation should therefore be possible within fractions of a second. However, there are also drawbacks compared to the Snapdragon 8 Gen 3, as speculative decoding is not possible.
The integrated Snapdragon X70 modem enables a maximum download speed of 5 Gbit/s and an upload speed of up to 3.5 Gbit/s. The modem is also able to support all globally known 5G bands. Qualcomm's FastConnect 7800 is responsible for local communication, which also supports Bluetooth 5.4 with LE Audio and Wi-Fi 7.
The SoC is manufactured at TSMC using the 4 nm process.
| Model | Mediatek Helio G100 | Qualcomm Snapdragon 8s Gen 3 | ||||||||||||||||||||||||||||||||
| Codename | Cortex-A76 / A55 | Cortex-X4 / A720 / A720 / A520 (Kryo) | ||||||||||||||||||||||||||||||||
| Series | Mediatek Mediatek Helio G | Qualcomm Snapdragon 8 | ||||||||||||||||||||||||||||||||
| Series: Snapdragon 8 Cortex-X4 / A720 / A720 / A520 (Kryo) |
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| Clock | 2000 - 2200 MHz | 2000 - 2800 MHz | ||||||||||||||||||||||||||||||||
| Cores / Threads | 8 / 8 2 x 2.2 GHz ARM Cortex-A76 6 x 2.0 GHz ARM Cortex-A55 | 8 / 8 1 x 3.0 GHz ARM Cortex-X4 4 x 2.8 GHz ARM Cortex-A720 3 x 2.3 GHz ARM Cortex-A520 | ||||||||||||||||||||||||||||||||
| Technology | 6 nm | 4 nm | ||||||||||||||||||||||||||||||||
| Features | 2x Cortex-A76, 6x Cortex-A55, 4G LTE Cat-12/13, 64MP AI-Camera support, LPDDR3/LPDDR4x-2133, eMMC 5.1, UFS 2.1, Beidou, Galileo, Glonass, GPS, Wi-Fi 5 (a/b/g/n/ac), AI Accelerator up to 1 TMACs, H.264 / H.265 / HEVC video encoding (4k30) | Adreno GPU, Spectra ISP, Hexagon, X70 5G Modem, FastConnect 7800 Wi-Fi 7, LPDDR5x 4800 MHz Memory Controller | ||||||||||||||||||||||||||||||||
| iGPU | ARM Mali-G57 MP2 | Qualcomm Adreno 735 | ||||||||||||||||||||||||||||||||
| Architecture | ARM | ARM v9.2 | ||||||||||||||||||||||||||||||||
| Announced | ||||||||||||||||||||||||||||||||||
| Manufacturer | www.mediatek.com | www.qualcomm.com | ||||||||||||||||||||||||||||||||
| L3 Cache | 8 MB |
Benchmarks
Average Benchmarks Mediatek Helio G100 → 100% n=14
Average Benchmarks Qualcomm Snapdragon 8s Gen 3 → 242% n=14
* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation