Qualcomm Snapdragon 888 4G vs MediaTek Dimensity 8050
Qualcomm Snapdragon 888 4G
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The Qualcomm Snapdragon 888 4G Mobile Platform is a high-end SoC for smartphones that was introduced in mid 2021 and manufactured in 5 nm at Samsung. Compared to the earlier released Snapdragon 888 5G, the 4G variant only features a 4G LTE modem.
The chip integrates one “Prime Core” based on a ARM Cortex-X1 architecture clocked at up to 2.84 GHz. Three more performance cores are based on the A78 but clock up to 2.42 GHz. Furthermore, four energy saving cores are integrated that are based on the ARM Cortex-A55 architecture and clock at up to 1.8 GHz. In addition to the processor cores, the SoC integrates a WiFi 6e modem, a Hexagon 780 DSP (up to 26 TOPS of AI performance) and a Spectra 580 ISP. The integrated memory controller now supports faster LPDDR5 memory with up to 3,200 MHz.
The performance of the processor cores should be around 15% better than the old Snapdragon 865+. The integrated Adreon 660 GPU should make a bigger jump by 35% (most likely compared to the SD 865).
MediaTek Dimensity 8050
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The MediaTek Dimensity 8050 is an ARM-based SoC (System-on-a-Chip) manufactured at TSMC using the 6nm process. It supports all current mobile standards including dual-SIM 5G (5G SA & NSA, max 4.7 Gbps download and 2.5 Gbps upload). The SoC also supports Wi-Fi 6 and Bluetooth 5.2.
The MediaTek Dimensity 8050 was specially designed for use in Android smartphones and is classified in the upper mid-range in terms of performance.
The CPU part consists of three clusters: a fast performance core, based on the ARM Cortex A78 architecture and clocked at up to 3 GHz. The second cluster consists of three Cortex-A78 cores with up to 2.6 GHz. Four ARM Cortex-A55 cores with up to 2 GHz are installed as a power-saving cluster.
The integrated ARM Mali-G77 MC9 graphics unit can drive displays with a resolution of up to 2,560 x 1,080 and a refresh rate of up to 144 Hz (possibly only with Full HD+).
Technically, the SoC is similar to the older Dimensity 1300.
Model | Qualcomm Snapdragon 888 4G | MediaTek Dimensity 8050 | ||||||||||||||||
Codename | Cortex-X1 / A78 / A55 (Kryo 680) | Cortex-A78 / A55 | ||||||||||||||||
Series | Qualcomm Snapdragon | |||||||||||||||||
Series: Snapdragon Cortex-X1 / A78 / A55 (Kryo 680) |
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Clock | 1800 - 2840 MHz | 2000 - 3000 MHz | ||||||||||||||||
L3 Cache | 3 MB | |||||||||||||||||
Cores / Threads | 8 / 8 1 x 2.8 GHz ARM Cortex-X1 3 x 2.4 GHz ARM Cortex-A78 4 x 1.8 GHz ARM Cortex-A55 | 8 / 8 1 x 3.0 GHz ARM Cortex-A78 3 x 2.6 GHz ARM Cortex-A78 4 x 2.0 GHz ARM Cortex-A55 | ||||||||||||||||
TDP | 5 Watt | |||||||||||||||||
Technology | 5 nm | 6 nm | ||||||||||||||||
Features | Adreno 660 GPU, Spectra 580 ISP, Hexagon 780, X60 5G Modem, FastConnect 6900 WiFi,LPDDR5-6400 / LPDDR4X-4266 MHz Memory Controller (64 Bit) | 1x ARM Cortex-A77 (3 GHz), 3x ARM Cortex-A77 (2.6 GHz), 4x ARM Cortex-A55 (2 GHz), ARM Mali-G77 MP9, APU 570, 5G Modem, MiraVision HDR10+, Wi-Fi 6, Bluetooth 5.2, UFS 3.1, LPDDR4x | ||||||||||||||||
iGPU | Qualcomm Adreno 660 | ARM Mali-G77 MP9 | ||||||||||||||||
Architecture | ARM | ARM | ||||||||||||||||
Announced | ||||||||||||||||||
Manufacturer | www.qualcomm.com | www.mediatek.com |
Benchmarks
Average Benchmarks Qualcomm Snapdragon 888 4G → 100% n=11
Average Benchmarks MediaTek Dimensity 8050 → 96% n=11

* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation