The MediaTek Dimensity 9200+ (9200 Plus) is a high-end SoC with an integrated 5G and Wi-Fi 7 modem. It includes one fast Cortex-X3 core with up to 3.35 GHz, three more A715 cores with up to 3 GHz and four power efficiency cores (Cortex-A510) with up to 2 GHz. The SoC is manufactured in the 2nd generation of the 4nm process at TSMC. All CPU cores can together use 8 MB of level 3 cache and 6 MB of System Level Cache (SLC).
Compared to the Dimensity 9200, the Plus model offers an increased peak performance of the CPU and GPU. The CPU clusters all offer higher clock speeds and also the Immortalis-G715 offers a 17% higher clock. Mediatek state, that this leads to a 10% higher CPU and GPU performance.
The integrated memory controller now supports LPDDR5X with 8533 Mbps. AI workloads can be accelerated with the APU 680.
The Dimensity 9200+ is manufactured in the modern 2nd generation 4nm process at TSMC.
The Mediatek Dimensity 1300 is a high-end SoC with an integrated 5G modem. It includes three CPU clusters. One fast ARM Cortex-A78 at up to 3 GHz with 2x L2 cache, 3 additional A78 with up to 2.6 GHz and for power efficiency four ARM Cortex-A55 cores at up to 2 GHz. The SoC looks to be identical to the older Dimensity 1200.
Furthermore, the chip integrates a 9 core ARM Mali-G77 MC9 GPU, a Wi-fi 6 modem (ax), a LPDDR4x memory controller (up to 5266Mbps), a AI processing unit (APU 3.0 with 6 cores) and video de- and encoding (including AV1).
The chip is manufactured in the modern 6nm process and should be very power efficient.
Average Benchmarks MediaTek Dimensity 9200+ → 100%n=10
Average Benchmarks MediaTek Dimensity 1300 → 59%n=10
- Range of benchmark values for this graphics card - Average benchmark values for this graphics card * Smaller numbers mean a higher performance 1 This benchmark is not used for the average calculation
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