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MagyarMediaTek Dimensity 7030 vs Qualcomm Snapdragon 7s Gen 2 vs MediaTek Dimensity 8050
MediaTek Dimensity 7030
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The Mediatek Dimensity 7030 is a mid-range ARM SoC (system-on-a-chip) that can be used in both smartphones and tablets (mainly Android). The SoC was introduced in September 2023.
It includes a 5G modem and supports the latest mobile phone standards in dual-SIM mode with both cards, so that surfing and phoning is possible via two different cards at the same time. The SoC integrates two ARM Cortex A78 cores with up to 2.5 GHz for demanding tasks and six low-power ARM Cortex A55 cores with clock speeds of up to 2 GHz.
The chip has an integrated sub-6 GHz and mmWave 5G modem including dual-SIM support that can reach a maximum download speed of up to 4.6 Gbps. Wi-Fi 6E (802.11ax) is supported as well as Bluetooth 5.2.
The memory controller can cope with LPDDR4x or LPDDR5 working memory as well as UFS 3.1 mass storage. As an integrated graphics card, the SoC uses the Mali-G610 MP3, which supports displays with 144 Hz as well as HDR10+ Adaptive, HLG and Dolby Vision at a maximum resolution of 2,520 x 1,080 pixels.
Compared to the Dimensity 920, the CPU unit has the same clock speeds but a more modern instruction set, ARMv8.2-A. A new graphics unit is used and WiFi 6E is supported, as well as displays with up to 144 Hz.
The SoC is manufactured in a 6nm process.
Qualcomm Snapdragon 7s Gen 2
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The Qualcomm Snapdragon 7s Gen 2 (SM7435-AB) is an ARMv9-A-based SoC for tablets and smartphones in the upper mid-range segment.
The Qualcomm Snapdragon 7s Gen 2 integrates a total of 8 cores divided into two clusters. The ARM Cortex-A78 cluster for high performance offers four cores with up to 2.4 GHz. The remaining 4 cores are based on the more energy-efficient A55 architecture and can be clocked at up to 1.95 GHz. All cores can run simultaneously or just a single cluster.
The SoC is similar to the Snapdragon 7 Gen 1 which offers a slightly lower clocked efficiency cluster and a different named GPU. The similar named Snapdragon 7+ Gen 2 is clearly faster with newer CPU cores. Although the naming suggest it, there was no Snapdragon 7s Gen 1.
LPDDR5 RAM is supported, with a frequency of up to 6,400 MHz.
The Snapdragon X62 5G modem is used as the modem. It supports a range of SA and NSA 5G mmWave and sub-6 GHz frequencies as well as Dynamic Spectrum Sharing (DSS). The X62 can achieve a maximum downlink speed of up to 2.9 Gbit/s in 5G networks.
The Adreno 710 forms the graphics subsystem. The GPU is capable of driving FHD+ displays at up to 144 Hz.
The Qualcomm Snapdragon 7s Gen 2 is manufactured using the modern 4nm EUV process.
MediaTek Dimensity 8050
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The MediaTek Dimensity 8050 is an ARM-based SoC (System-on-a-Chip) manufactured at TSMC using the 6nm process. It supports all current mobile standards including dual-SIM 5G (5G SA & NSA, max 4.7 Gbps download and 2.5 Gbps upload). The SoC also supports Wi-Fi 6 and Bluetooth 5.2.
The MediaTek Dimensity 8050 was specially designed for use in Android smartphones and is classified in the upper mid-range in terms of performance.
The CPU part consists of three clusters: a fast performance core, based on the ARM Cortex A78 architecture and clocked at up to 3 GHz. The second cluster consists of three Cortex-A78 cores with up to 2.6 GHz. Four ARM Cortex-A55 cores with up to 2 GHz are installed as a power-saving cluster.
The integrated ARM Mali-G77 MC9 graphics unit can drive displays with a resolution of up to 2,560 x 1,080 and a refresh rate of up to 144 Hz (possibly only with Full HD+).
Technically, the SoC is similar to the older Dimensity 1300.
| Model | MediaTek Dimensity 7030 | Qualcomm Snapdragon 7s Gen 2 | MediaTek Dimensity 8050 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Series | Mediatek | Qualcomm Snapdragon | Mediatek | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Codename | Cortex-A78 / A55 | Cortex-A78 / A55 | Cortex-A78 / A55 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Series: Cortex-A78 / A55 |
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| Clock | 2000 - 2500 MHz | 1950 - 2400 MHz | 2000 - 3000 MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Cores / Threads | 8 / 8 2 x 2.5 GHz ARM Cortex-A78 6 x 2.0 GHz ARM Cortex-A55 | 8 / 8 4 x 2.4 GHz ARM Cortex-A78 4 x 2.0 GHz ARM Cortex-A55 | 8 / 8 1 x 3.0 GHz ARM Cortex-A78 3 x 2.6 GHz ARM Cortex-A78 4 x 2.0 GHz ARM Cortex-A55 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Technology | 6 nm | 4 nm | 6 nm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Features | 2x ARM Cortex-A78 (2.5 GHz), 6x ARM Cortex-A55 (2 GHz), ARM Mali-G610 MC3, 5G Sub-6 GHz, LTE | 1x ARM Cortex-A77 (3 GHz), 3x ARM Cortex-A77 (2.6 GHz), 4x ARM Cortex-A55 (2 GHz), ARM Mali-G77 MP9, APU 570, 5G Modem, MiraVision HDR10+, Wi-Fi 6, Bluetooth 5.2, UFS 3.1, LPDDR4x | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| iGPU | ARM Mali-G610 MP3 | Qualcomm Adreno 710 | ARM Mali-G77 MP9 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Architecture | ARM | ARM | ARM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Announced | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Manufacturer | www.mediatek.com | www.qualcomm.com | www.mediatek.com |
- Average benchmark values for this graphics card