MediaTek Dimensity 700 vs Qualcomm Snapdragon S4 Pro MSM8960T vs UNISOC T8200 (T765)
MediaTek Dimensity 700
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The Mediatek Dimensity 700 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Compared to the similar Dimensity 800U, the 700 offers lower clocked CPU cores (-200 MHz) and a slower GPU (one less core).
Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x-2133 memory controller, a AI processing unit (APU 3.0) and video de- and encoding.
The Dimensity 700 is manufactured in the modern 7nm process and should be very power efficient.
Qualcomm Snapdragon S4 Pro MSM8960T
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The Qualcomm MSM8960T (Snapdragon S4 Pro) is a fast ARM SoC, which is mainly used in smartphones. It integrates a Krait-based dual-core processor and an Adreno 320 graphics card. Furthermore it features an integrated LPDDR2 memory controller (dual channel, max. 500 MHz) as well as various radio standards including LTE. The chip is fabricated at TSMC in a 28nm LP process.
Unlike older Qualcomm SoCs, which are still based on slower Scorpion cores, the MSM8960T uses the modern Krait architecture. The Krait design is significantly faster than the Cortex-A5, Cortex-A7 and Cortex-A9 architecture from ARM and just behind the high-end Cortex-A15. The two cores are clocked at 1.7 GHz and offer a performance, which is even above some older quad-cores like Nvidia's Tegra 3 or the Samsung Exynos 4412.
The Adreno 320 graphics card is the same as found in the Snapdragon 600 and one of the fastest mobile GPUs in mid-2013. The GPU is clocked at 400 MHz and offers enough performance for demanding games and high resolution screens.
Since the MSM8960T only has two CPU cores, the power consumption should be somewhat below quad-cores like the Snapdragon 600. The chip can therefore be used in compact smartphones with a smaller battery.
UNISOC T8200 (T765)
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The UniSoc T8200 (former UniSoc T765) is a mid-range SoC with 8 processor cores in two clusters. The two large ARM Cortex-A76 cores are clocked at up to 2.3 GHz. The six smaller cores run at up to 2.1 GHz.
The integrated memory controller supports LPDDR4/4X with up to 2133 MHz (2x 16 bit). The integrated ISP supports a camera up to 108 MPixel. The integrated graphics card is an ARM Mali-G57 MC2 (2 cores) is used. The built-in 5G modem supports TDD+FDD CA in the sub-6GHz spectrum with 130 MHz bandwidth.
The chip is manufactured using the somewhat older 6nm process (EUV at TSMC).
Model | MediaTek Dimensity 700 | Qualcomm Snapdragon S4 Pro MSM8960T | UNISOC T8200 (T765) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Codename | Cortex-A76 / A55 | ARMv7 | Cortex-A76 / A55 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Clock | 2000 - 2200 MHz | 1700 MHz | 2100 - 2300 MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Cores / Threads | 8 / 8 2 x 2.2 GHz ARM Cortex-A76 6 x 2.0 GHz ARM Cortex-A55 | 2 / 2 | 8 / 8 2 x 2.3 GHz ARM Cortex-A76 6 x 2.1 GHz ARM Cortex-A55 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Technology | 7 nm | 28 nm | 6 nm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Features | 2x ARM Cortex-A76 (2.2 GHz), 6x ARM Cortex-A55 (2 GHz), ARM Mali-G75 MC2, APU 3.0, 5G Modem (2CC), MiraVision (4K HDR Video, 80MP Photo), Wi-Fi 5, Bluetooth 5.1, UFS 2.2, 16GB LPDDR4x Support | LTE, HSPA+, EDGE, GSM, GPRS, GPS, WiFi, Bluetooth, NFC, FM | ISP (2 main + 2 subsidiary, 108M 4-in-1, 64M ZSL) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
iGPU | ARM Mali-G57 MP2 ( - 950 MHz) | Qualcomm Adreno 320 (400 MHz) | ARM Mali-G57 MP2 ( - 850 MHz) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Architecture | ARM | ARM | ARM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Announced | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Manufacturer | www.mediatek.com | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Series | Qualcomm Snapdragon | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Series: Snapdragon ARMv7 |
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L1 Cache | 64 KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
L2 Cache | 1 MB |
Benchmarks
Average Benchmarks MediaTek Dimensity 700 → 0% n=0
Average Benchmarks Qualcomm Snapdragon S4 Pro MSM8960T → 0% n=0
Average Benchmarks UNISOC T8200 (T765) → 0% n=0

* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation