MediaTek Dimensity 6080 vs MediaTek Dimensity 700 vs UNISOC T8200 (T765)
MediaTek Dimensity 6080
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The MediaTek Dimensity 6080 (MT6833V/MT6833GP) is an ARM-based SoC (system-on-a-chip) manufactured by TSMC using the 6 nm process. It was specially designed for use in Android smartphones and is in the lower mid-range in terms of performance. It supports all current mobile communication standards, including 5G Sub6.
The SoC is identical to the MediaTek Dimensity 810 the only difference is that the Dimensity 6080 can cope with a camera resolution of up to 108 megapixels.
The CPU works with a total of eight cores, which are divided into two clusters. One has two ARM Cortex-A76 power cores with up to 2.4 GHz each, while the other has six ARM Cortex-A55 energy-saving cores with up to 2.0 GHz each. LPDDR4x RAM with 2,133 MHz can be used as RAM and UFS 2.2 is supported as internal memory.
In terms of connectivity, dual 5G (Sub6) with a theoretical peak download speed of up to 2.77 GBit/s is available, as well as Wi-Fi 5 and Bluetooth 5.1.
The integrated graphics unit ARM Mali-G57 MP2 can power displays with a resolution of up to 2,520 x 1,080 pixels (Full HD+) and a refresh rate of up to 120 Hz.
MediaTek Dimensity 700
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The Mediatek Dimensity 700 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Compared to the similar Dimensity 800U, the 700 offers lower clocked CPU cores (-200 MHz) and a slower GPU (one less core).
Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x-2133 memory controller, a AI processing unit (APU 3.0) and video de- and encoding.
The Dimensity 700 is manufactured in the modern 7nm process and should be very power efficient.
UNISOC T8200 (T765)
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The UniSoc T8200 (former UniSoc T765) is a mid-range SoC with 8 processor cores in two clusters. The two large ARM Cortex-A76 cores are clocked at up to 2.3 GHz. The six smaller cores run at up to 2.1 GHz.
The integrated memory controller supports LPDDR4/4X with up to 2133 MHz (2x 16 bit). The integrated ISP supports a camera up to 108 MPixel. The integrated graphics card is an ARM Mali-G57 MC2 (2 cores) is used. The built-in 5G modem supports TDD+FDD CA in the sub-6GHz spectrum with 130 MHz bandwidth.
The chip is manufactured using the somewhat older 6nm process (EUV at TSMC).
| Model | MediaTek Dimensity 6080 | MediaTek Dimensity 700 | UNISOC T8200 (T765) | ||||||||||||
| Codename | Cortex-A76 / A55 | Cortex-A76 / A55 | Cortex-A76 / A55 | ||||||||||||
| Series | Mediatek Dimensity 6000 | ||||||||||||||
| Series: Dimensity 6000 Cortex-A76 / A55 |
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| Clock | 2000 - 2400 MHz | 2000 - 2200 MHz | 2100 - 2300 MHz | ||||||||||||
| Cores / Threads | 8 / 8 2 x 2.4 GHz ARM Cortex-A76 6 x 2.0 GHz ARM Cortex-A55 | 8 / 8 2 x 2.2 GHz ARM Cortex-A76 6 x 2.0 GHz ARM Cortex-A55 | 8 / 8 2 x 2.3 GHz ARM Cortex-A76 6 x 2.1 GHz ARM Cortex-A55 | ||||||||||||
| Technology | 6 nm | 7 nm | 6 nm | ||||||||||||
| Features | Wi-Fi 5 (1T1R Antenna), 5G Multi-Mode 2.77 Gbps Download, GNSS: GPS L1CA+L5, BeiDou B1I+ B2a, Glonass L1OF, Galileo E1 + E5a, QZSS L1CA+ L5, NavIC | 2x ARM Cortex-A76 (2.2 GHz), 6x ARM Cortex-A55 (2 GHz), ARM Mali-G75 MC2, APU 3.0, 5G Modem (2CC), MiraVision (4K HDR Video, 80MP Photo), Wi-Fi 5, Bluetooth 5.1, UFS 2.2, 16GB LPDDR4x Support | ISP (2 main + 2 subsidiary, 108M 4-in-1, 64M ZSL) | ||||||||||||
| iGPU | ARM Mali-G57 MP2 | ARM Mali-G57 MP2 ( - 950 MHz) | ARM Mali-G57 MP2 ( - 850 MHz) | ||||||||||||
| Architecture | ARM | ARM | ARM | ||||||||||||
| Announced | |||||||||||||||
| Manufacturer | www.mediatek.com | www.mediatek.com |
Benchmarks
Average Benchmarks MediaTek Dimensity 6080 → 100% n=4
Average Benchmarks MediaTek Dimensity 700 → 86% n=4
Average Benchmarks UNISOC T8200 (T765) → 97% n=4
* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation
