MediaTek Dimensity 1100 vs MediaTek Dimensity 9000 vs MediaTek Dimensity 8020
MediaTek Dimensity 1100
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The Mediatek Dimensity 1100 is a fast mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A78 cores at up to 2.6 GHz and four power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 9 core ARM Mali-G77 MC9 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller, a AI processing unit (APU 3.0 with 6 cores) and video de- and encoding. As one of the first SoCs, the Dimensity 1000 series offers AV1 hardware decoding. The chip is manufactured in the modern 7nm process and should be very power efficient.
MediaTek Dimensity 9000
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The MediaTek Dimensity 9000 is a high-end SoC with an integrated 5G modem. It includes one fast Cortex-X2 core with up to 3 GHz, three more A710 cores with up to 2.85 GHz and four power efficiency cores (Cortex-A510) with upto 1.8 GHz. The SoC is manufactured in the new 4nm process at TSMC. All CPU cores can together use 8 MB of level 3 cache and 6 MB of System Level Cache (SLC).
The integrated quad channel memory controller supports LPDDR5X with 7500 Mbps. The integrated GPU is an ARM Mali-G710 MC10 (10 of the 16 possible cores).
The Dimensity 9000 is one of the first chips to be produced in the modern 4nm process at TSMC
MediaTek Dimensity 8020
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The MediaTek Dimensity 8020 is a ARM-based System-on-a-Chip (SoC) similar to the older Dimensity 1100. It was specifically designed for use in Android smartphones and falls into the mid-range category in terms of performance. It supports all current mobile network standards, including 5G with 2CC-CA (200MHz) and FDD+TDD.
The CPU consists of a total of eight cores divided into two clusters. One cluster has four ARM Cortex-A78 performance cores with speeds of up to 2.6 GHz, while the other cluster has four ARM Cortex-A55 power-efficient cores with speeds of up to 2.0 GHz. LPDDR4 RAM can be used as the memory, and it supports UFS 3.1 as the internal storage.
In terms of connectivity, it offers Dual-5G support, as well as Wi-Fi 6 and Bluetooth 5.2.
The integrated graphics unit, ARM Mali-G77 MC9, can power displays with a resolution of up to 2560 x 1080 and a refresh rate of up to 144 Hz (possibly only for Full HD+).
The chip is manufactured by TSMC using the current 6nm process in the mid-range segment.
| Model | MediaTek Dimensity 1100 | MediaTek Dimensity 9000 | MediaTek Dimensity 8020 |
| Codename | Cortex-A78 / A55 | Cortex-X2 / A710 / A510 | Cortex-A78 / A55 |
| Clock | 2000 - 2600 MHz | 1800 - 3050 MHz | 2000 - 2600 MHz |
| Cores / Threads | 8 / 8 | 8 / 8 1 x 3.1 GHz ARM Cortex-X2 3 x 2.9 GHz ARM Cortex-A710 4 x 1.8 GHz ARM Cortex-A510 | 8 / 8 4 x 2.6 GHz ARM Cortex-A77 4 x 2.0 GHz ARM Cortex-A55 |
| Technology | 6 nm | 4 nm | 6 nm |
| Features | 4x A77 (2.6 GHz), 4x ARM Cortex-A55 (2 GHz), ARM Mali-G77 MC9, APU 3.0, 5G Modem, MiraVision (4K HDR Video, 80MP Photo), Wi-Fi 6, Bluetooth 5.2, UFS 3.1, 16GB-4266 LPDDR4x Support | 1x ARM Cortex-X2 (3.05 GHz), 3x A710 (2.85 GHz), 4x ARM Cortex-A510 (1.8 GHz), ARM Mali-G710 MC10, APU 590, Imagiq 790, 5G Modem (3GPP Release-16), LPDDR5X 7500 Mbps | 4x ARM Cortex-A77 (2.6 GHz), 4x ARM Cortex-A55 (2 GHz), ARM Mali-G77 MP9, APU 570, 5G Modem, MiraVision HDR10+, Wi-Fi 6, Bluetooth 5.2, UFS 3.1, LPDDR4x |
| iGPU | ARM Mali-G77 MP9 | ARM Mali-G710 MP10 | ARM Mali-G77 MP9 |
| Architecture | ARM | ARM | ARM |
| Announced | |||
| Manufacturer | www.mediatek.com | www.mediatek.com | www.mediatek.com |
| Series | Mediatek Dimensity 9000 | ||
| L3 Cache | 14 MB |
Benchmarks
Average Benchmarks MediaTek Dimensity 1100 → 100% n=4
Average Benchmarks MediaTek Dimensity 9000 → 176% n=4
Average Benchmarks MediaTek Dimensity 8020 → 125% n=4
* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation
