New rumour suggests that AMD Zen 5 Ryzen 8000 processors and RDNA 4 graphics cards are unlikely to be fabbed on TSMC's 3 nm node ^↺

AMD Ceo Dr Lisa Su confirmed that the upcoming Ryzen 7000 series of desktop processors based on the Zen 4 architecture will use TSMC's 5 nm process node. The upcoming RDNA 3-based Radeon RX 7000 series graphics cards are also expected to employ the same technology. According to leaked roadmaps, its successors (Zen 5/RDNA 4) were rumoured to use the Taiwanese chipmaker's upcomong 3 nm node. However, Twitter leaker @Greymon55 now casts doubt on this speculation.

It seems that TSMC has run into quite a few snags with its 3 nm node, and that's why AMD could be forced to use TSMC's N4 node instead. The same sentiment is echoed by a Digitimes report, which states that the 3 nm yields have been sub-par, prompting TSMC to divvy up the process into sub-nodes such as N3E and N3B. It further adds that TSMC has to fine-tune the process even further on an OEM-by-OEM basis. The aforementioned factors could prompt TSMC to push the tentative 3 nm release date beyond earlier estimates to H2, 2022. Another Twitter user chimed in, stating that Zen 5 could either use TSMC 3 nm or launch in H2, 2023, but not both.

Previous reports suggested that there are several multi-billion dollar companies lined up to get a piece of TSMC's N3 node. Intel, in particular, has shown great interest in it, as has Apple and MediaTek. On the other hand, Qualcomm has decided to try its luck with Samsung LSI's 3 nm node, which will be the world's first to use GAAFET (Gate-all-around Field-Effect Transistor). If TSMC's woes aren't addressed in the coming months, AMD could likely jump ship to Samsung for some of its lower-tier parts.