Qualcomm QCM6490 vs Qualcomm Snapdragon 7s Gen 3
Qualcomm QCM6490
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The Qualcomm QCM6490 is an upper mid-range SoC and is based on the Snapdragon 778G, but this variant is an extended-life chipset. The QCM6490 is being used for the first time in the Android smartphone Fairphone 5, but has actually been designed for corporate use and IoT applications.
The Kyro 670 CPU consists of a total of eight cores, which are divided into three clusters. The first cluster consists of just one high-performance core (Kyro Gold Plus, Cortex-A78), which operates at up to 2.71 GHz. The second cluster contains three further Cortex-A78 cores (Kyro Gold), each clocking at up to 2.40 GHz. The remaining four power-saving cores (Kyro Silver, Cortex-A55) are located in the last cluster and operate at up to 1.96 GHz. For the graphics calculations, an Adreno 643 with 812 MHz is integrated.
The QCM6490 SoC has an integrated 5G modem that supports both 5G-Sub6 and 5G-mmWave. In theory, this enables data rates of up to 3.7 Gbit/s downlink and 2.5 Gbit/s upload. Wi-Fi 6E is also on board, which supports the 6 GHz band.
The SoC is manufactured using the 6 nm process.
Qualcomm Snapdragon 7s Gen 3
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The Qualcomm Snapdragon 7s Gen 3 (SM7635) is an ARMv9-based SoC intended for use in Android-based smartphones and tablets.
The CPU unit consists of three clusters: these are made up of a prime core (Cortex A720), which operates at up to 2.5 GHz, three performance cores (Cortex A720, up to 2.4 GHz) and four power-saving units (Cortex A520, up to 1.8 GHz). Either LPDDR4x (up to 2,133 MHz) or LPDDR5 (up to 3,200 MHz) can be used as the main memory. The integrated Adreno 810 iGPU takes care of the graphics calculations.
Other features include a triple ISP, support for Qualcomm aptX Lossless Audio, a 30% improvement in AI performance compared to its predecessor, Bluetooth 5.4 and Wi-Fi 6E. It also supports fast UFS 3.1 memory and triple-frequency GNSS. The 5G modem RF system supports both 5G Sub6 and mmWave, which should enable download data rates of up to 2.9 Gbit/s.
The SoC is manufactured in the 4 nm process at TSMC.
Model | Qualcomm QCM6490 | Qualcomm Snapdragon 7s Gen 3 | ||||||||||||||||||||
Codename | Kryo 670 (Cortex-A78/A55) | Cortex-A720 / A520 | ||||||||||||||||||||
Series | Qualcomm Snapdragon | Qualcomm Snapdragon | ||||||||||||||||||||
Series: Snapdragon Kryo 670 (Cortex-A78/A55) |
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Clock | 1960 - 2710 MHz | 1800 - 2630 MHz | ||||||||||||||||||||
Cores / Threads | 8 / 8 | 8 / 8 1 x 2.5 GHz ARM Cortex-A720 3 x 2.4 GHz ARM Cortex-A720 4 x 1.8 GHz ARM Cortex-A520 | ||||||||||||||||||||
Technology | 6 nm | 4 nm | ||||||||||||||||||||
Features | Dual-Band GNSS, AI Engine (Gen. 6), Hexagon 770, Sensing Hub (Gen. 2), FastConnect 6900, Bluetooth 5.2, Spectra 570L ISP; LPDDR5 (3200 MHz) / LPDDR4x (2133 MHz) | |||||||||||||||||||||
iGPU | Qualcomm Adreno 643 (812 MHz) | Qualcomm Adreno 810 | ||||||||||||||||||||
Architecture | ARM | ARM | ||||||||||||||||||||
Announced | ||||||||||||||||||||||
Manufacturer | www.qualcomm.com | www.qualcomm.com |
Benchmarks
Average Benchmarks Qualcomm QCM6490 → 100% n=20
Average Benchmarks Qualcomm Snapdragon 7s Gen 3 → 117% n=20

* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation