Qualcomm Snapdragon 6 Gen 1 vs MediaTek Dimensity 8050 vs MediaTek Dimensity 920
Qualcomm Snapdragon 6 Gen 1
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The Qualcomm Snapdragon 6 Gen 1 (SM6450) mobile platform was designed for Android-based smartphones and tablets and was launched in September 2022. The SoC (system-on-a-chip) is in the entry-level class and is based on ARM's v9 architecture.
The cryo CPU of the Snapdragon 6 Gen 1 is based on four ARM Cortex-A78 performance cores with clock frequencies of up to 2.2 GHz and an efficiency cluster consisting of four Cortex-A55 cores with a clock frequency of 1.8 GHz.
An Adreno 710 is used as the integrated graphics unit. The Soc also integrates a Spectra ISP (200 MP photo), a dual-channel 16-bit LPDDR 2750 MHz memory controller, an X62 5G modem (max 2.9 GBit/s download, 1.6 Gbit/s upload), a Fastconnect 6700 Wi-Fi 6E / Bluetooth 5.2 modem and Hexagon.
The SoC is manufactured in the modern 4 nm process at Samsung.
MediaTek Dimensity 8050
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The MediaTek Dimensity 8050 is an ARM-based SoC (System-on-a-Chip) manufactured at TSMC using the 6nm process. It supports all current mobile standards including dual-SIM 5G (5G SA & NSA, max 4.7 Gbps download and 2.5 Gbps upload). The SoC also supports Wi-Fi 6 and Bluetooth 5.2.
The MediaTek Dimensity 8050 was specially designed for use in Android smartphones and is classified in the upper mid-range in terms of performance.
The CPU part consists of three clusters: a fast performance core, based on the ARM Cortex A78 architecture and clocked at up to 3 GHz. The second cluster consists of three Cortex-A78 cores with up to 2.6 GHz. Four ARM Cortex-A55 cores with up to 2 GHz are installed as a power-saving cluster.
The integrated ARM Mali-G77 MC9 graphics unit can drive displays with a resolution of up to 2,560 x 1,080 and a refresh rate of up to 144 Hz (possibly only with Full HD+).
Technically, the SoC is similar to the older Dimensity 1300.
MediaTek Dimensity 920
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The Mediatek Dimensity 920 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores at up to 2.5 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 4 core ARM Mali-G68 MC4 GPU, a Wi-fi 6 modem, a LPDDR4x memory controller, a AI processing unit and video de- and encoding.
The 5G modem supports Sub-6 GHz and dual SIM. The download speeds can reach up to 2.7 Gbit/s.
Compared to the older Dimensity 900, the 920 offers slightly higher clock speeds for the CPU and GPU.
The Dimensity 920 is manufactured in the modern 6nm process and should be very power efficient.
Model | Qualcomm Snapdragon 6 Gen 1 | MediaTek Dimensity 8050 | MediaTek Dimensity 920 | ||||||||
Codename | Cortex-A78 / A55 | Cortex-A78 / A55 | Cortex-A78 / A55 | ||||||||
Series | Qualcomm Snapdragon 6 | ||||||||||
Series: Snapdragon 6 Cortex-A78 / A55 |
| ||||||||||
Clock | 1800 - 2200 MHz | 2000 - 3000 MHz | 2000 - 2500 MHz | ||||||||
Cores / Threads | 8 / 8 4 x 2.2 GHz ARM Cortex-A78 4 x 1.8 GHz ARM Cortex-A55 | 8 / 8 1 x 3.0 GHz ARM Cortex-A78 3 x 2.6 GHz ARM Cortex-A78 4 x 2.0 GHz ARM Cortex-A55 | 8 / 8 | ||||||||
Technology | 4 nm | 6 nm | 6 nm | ||||||||
Features | 12-Bit Spectra Triple ISP, 7th Gen AI Engine, Wi-Fi 6E, X62 5G Modem | 1x ARM Cortex-A77 (3 GHz), 3x ARM Cortex-A77 (2.6 GHz), 4x ARM Cortex-A55 (2 GHz), ARM Mali-G77 MP9, APU 570, 5G Modem, MiraVision HDR10+, Wi-Fi 6, Bluetooth 5.2, UFS 3.1, LPDDR4x | 2x ARM Cortex-A78 (2.5 GHz), 6x ARM Cortex-A55 (2 GHz), ARM Mali-G68 MC4, 5G NR Sub-6 GHz, LTE | ||||||||
iGPU | Qualcomm Adreno 710 | ARM Mali-G77 MP9 | ARM Mali-G68 MP4 | ||||||||
Architecture | ARM | ARM | ARM | ||||||||
Announced | |||||||||||
Manufacturer | www.qualcomm.com | www.mediatek.com | www.mediatek.com |
Benchmarks
Average Benchmarks Qualcomm Snapdragon 6 Gen 1 → 100% n=13
Average Benchmarks MediaTek Dimensity 8050 → 115% n=13
Average Benchmarks MediaTek Dimensity 920 → 81% n=13

* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation