MediaTek Dimensity 7030 vs Qualcomm Snapdragon 6 Gen 1
MediaTek Dimensity 7030
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The Mediatek Dimensity 7030 is a mid-range ARM SoC (system-on-a-chip) that can be used in both smartphones and tablets (mainly Android). The SoC was introduced in September 2023.
It includes a 5G modem and supports the latest mobile phone standards in dual-SIM mode with both cards, so that surfing and phoning is possible via two different cards at the same time. The SoC integrates two ARM Cortex A78 cores with up to 2.5 GHz for demanding tasks and six low-power ARM Cortex A55 cores with clock speeds of up to 2 GHz.
The chip has an integrated sub-6 GHz and mmWave 5G modem including dual-SIM support that can reach a maximum download speed of up to 4.6 Gbps. Wi-Fi 6E (802.11ax) is supported as well as Bluetooth 5.2.
The memory controller can cope with LPDDR4x or LPDDR5 working memory as well as UFS 3.1 mass storage. As an integrated graphics card, the SoC uses the Mali-G610 MP3, which supports displays with 144 Hz as well as HDR10+ Adaptive, HLG and Dolby Vision at a maximum resolution of 2,520 x 1,080 pixels.
Compared to the Dimensity 920, the CPU unit has the same clock speeds but a more modern instruction set, ARMv8.2-A. A new graphics unit is used and WiFi 6E is supported, as well as displays with up to 144 Hz.
The SoC is manufactured in a 6nm process.
Qualcomm Snapdragon 6 Gen 1
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The Qualcomm Snapdragon 6 Gen 1 (SM6450) mobile platform was designed for Android-based smartphones and tablets and was launched in September 2022. The SoC (system-on-a-chip) is in the entry-level class and is based on ARM's v9 architecture.
The cryo CPU of the Snapdragon 6 Gen 1 is based on four ARM Cortex-A78 performance cores with clock frequencies of up to 2.2 GHz and an efficiency cluster consisting of four Cortex-A55 cores with a clock frequency of 1.8 GHz.
An Adreno 710 is used as the integrated graphics unit. The Soc also integrates a Spectra ISP (200 MP photo), a dual-channel 16-bit LPDDR 2750 MHz memory controller, an X62 5G modem (max 2.9 GBit/s download, 1.6 Gbit/s upload), a Fastconnect 6700 Wi-Fi 6E / Bluetooth 5.2 modem and Hexagon.
The SoC is manufactured in the modern 4 nm process at Samsung.
| Model | MediaTek Dimensity 7030 | Qualcomm Snapdragon 6 Gen 1 | ||||||||
| Codename | Cortex-A78 / A55 | Cortex-A78 / A55 | ||||||||
| Clock | 2000 - 2500 MHz | 1800 - 2200 MHz | ||||||||
| Cores / Threads | 8 / 8 2 x 2.5 GHz ARM Cortex-A78 6 x 2.0 GHz ARM Cortex-A55 | 8 / 8 4 x 2.2 GHz ARM Cortex-A78 4 x 1.8 GHz ARM Cortex-A55 | ||||||||
| Technology | 6 nm | 4 nm | ||||||||
| Features | 2x ARM Cortex-A78 (2.5 GHz), 6x ARM Cortex-A55 (2 GHz), ARM Mali-G610 MC3, 5G Sub-6 GHz, LTE | 12-Bit Spectra Triple ISP, 7th Gen AI Engine, Wi-Fi 6E, X62 5G Modem | ||||||||
| iGPU | ARM Mali-G610 MP3 | Qualcomm Adreno 710 | ||||||||
| Architecture | ARM | ARM | ||||||||
| Announced | ||||||||||
| Manufacturer | www.mediatek.com | www.qualcomm.com | ||||||||
| Series | Qualcomm Snapdragon 6 | |||||||||
| Series: Snapdragon 6 Cortex-A78 / A55 |
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Benchmarks
Average Benchmarks MediaTek Dimensity 7030 → 100% n=16
Average Benchmarks Qualcomm Snapdragon 6 Gen 1 → 99% n=16
- Average benchmark values for this graphics card* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation
