UNISOC Tangula T770 vs MediaTek Dimensity 820 vs MediaTek Dimensity 700

UNISOC Tangula T770

The Unisoc T770 Tanggula (former Spreadtrum) is a mid range SoC for Android based smartphones and tablets. It integrates an octa-core CPU with three clusters. One fast ARM Cortex-A76 clocked at up to 2.5 GHz, three more A76 performance cores clocked at up to 2.2 GHz and a power efficiency cluster of four ARM-Cortex-A55 cores with up to 2 GHz. The integrated memory controller supports LPDDR4/4X with up to 2133 MHz (2x 16 Bit). The integrated ISP supports two main cameras and two subsidiary cameras (up to 108 MPix). The integrated graphics card is an ARM Mali-G57 MC4 (4 cores) at up to 780 MHz. Unisoc also specifies that the T770 offers hardware AI acceleration.

The chip is manufactured in the modern 6nm process.

MediaTek Dimensity 820

The Mediatek Dimensity 820 is a fast mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A76 cores at up to 2.6 GHz and four power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 5 core ARM Mali-G57 MC5 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller, a AI processing unit (APU 3.0) and video de- and encoding. The Dimensity 820 is manufactured in the modern 7nm process and should be very power efficient.

MediaTek Dimensity 700

The Mediatek Dimensity 700 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Compared to the similar Dimensity 800U, the 700 offers lower clocked CPU cores (-200 MHz) and a slower GPU (one less core).

Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x-2133 memory controller, a AI processing unit (APU 3.0) and video de- and encoding.

The Dimensity 700 is manufactured in the modern 7nm process and should be very power efficient.