Qualcomm Snapdragon G3x Gen 1 vs MediaTek Dimensity 8100

Qualcomm Snapdragon G3x Gen 1

The Qualcomm Snapdragon G3x Gen 1 (model number: SG8175P) is a revised version of the Snapdragon 888+ 5Gwhich is intended for use in Android-based gaming handhelds and tablets.

The SoC (system-on-a-chip) integrates a fast ARM Cortex-X1-based "Kryo 680 Prime Core" with up to 3.00 GHz and three additional fast Kryo 680 Gold performance cores (Cortex-A78-based) with up to 2.42 GHz. To save power, four additional Kyro 680 Silver (ARM Cortex-A55 based) cores have also been integrated, which operate at up to 1.8 GHz. An Adreno 660 is responsible for graphics acceleration.

The integrated Snapdragon X60 5G modem enables download speeds of up to 7.5 Gbit/s and upload speeds of up to 3 Gbit/s and supports DSS, mmWave and Sub6. The integrated FastConnect 6900 Wi-Fi modem supports all common standards, including Wi-Fi 6E with 6 GHz. Bluetooth version 5.2 is on board.

The SoC is manufactured using the 5 nm EUV process.

MediaTek Dimensity 8100

The Mediatek Dimensity 8100 is a upper mid-range smartphone SoC. The CPU integrates four fast ARM Cortex-A78 cores with up to 2.85 GHz and four efficient Cortex-A55 cores with up to 2 GHz. The integrated 5G modem supports all modern standards including 5G SA and a maximum download speed of 4.7 Gbps.

The integrated ARM Mali-G610 MC6 GPU integrates 6 cores and supports displays with up to 2,960 x 1,440 pixels (WQHD+).

The chip is produced at TSMC in 5nm.