Qualcomm Snapdragon 662 vs Mediatek Helio G95 vs Mediatek Helio G90T

Qualcomm Snapdragon 662

The Qualcomm Snapdragon 662 is a lower mid-range ARM-based SoC largely found in Android tablets and smartphones. It features 8 Kryo 260 cores (custom design, 64-Bit capable) that are divided in two clusters. A fast cluster of four cores with up to 2 GHz (Kryo 260 Gold - Cortex-A73 derivate) and a power saving efficiency cluster with up to 1.8 GHz (Kryo 260 Silver - Cortex A53 derivate). Both clusters can also be used together.

In addition to the 8 CPU cores, the SoC integrates a mid range Adreno 610 GPU with a LPDDR4 memory controller (dual-channel)  and supports Wi-Fi (802.11ac + MIMO, max. 867 Mbps), Bluetooth 5, and LTE (X12 LTE modem with up to 600 Mbps download and 150 Mbps upload).

Power Consumption

Thanks to the new 11 nm LPP process, the energy efficiency should be quite good.

Mediatek Helio G95

The Mediatek Helio G95 is an upper mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2020. It is manufactured in a 12 nm FinFET process and is equipped with 2x big ARM Cortex-A76 cores with up to 2.05 GHz and 6x small and power efficient ARM Cortex-A55 cores (max. 2 GHz) in two clusters (bigLITTLE). The chip also integrates a ARM Mali-G76 3EEMC4 (should be a MP4 - four cluster variant) clocked at 900 MHz. Compared to the similar Helio G90T, the difference is the 100 MHz higher clocked graphics card.

Furthermore, the integrated LTE modem supports Cat-12 600 Mbps download and Cat-13 150 Mbps upload speeds. Wi-Fi 5 is also integrated (a/b/g/n/ac). The memory controller supports LPDDR3 and LPDDR4x with up to 2,133 MHz with up to 10 GB capacity.

Mediatek Helio G90T

The Mediatek Helio G90T is an upper mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2019. It is manufactured in a 12 nm FinFET process and is equipped with 2x big ARM Cortex-A76 cores with up to 2.05 GHz and 6x small and power efficient ARM Cortex-A55 cores (max. 2 GHz) in two clusters (bigLITTLE). The chip also integrates a ARM Mali-G76 3EEMC4 (should be a MP4 - four cluster variant) clcoked at 800 MHz. Furthermore, the integrated LTE modem supports Cat-12 600 Mbps download and Cat-13 150 Mbps upload speeds. Wi-Fi 5 is also integrated (a/b/g/n/ac). The memory controller supports LPDDR3 and LPDDR4x with up to 2,133 MHz with up to 10 GB capacity.