Qualcomm Snapdragon 450 vs Mediatek Helio P25 vs Qualcomm Snapdragon 625

Qualcomm Snapdragon 450

The Qualcomm Snapdragon 450 (SD450) is a lower mainstream SoC for (Android based) smartphones and tablets. It features eight ARM Cortex-A53 cores at up to 1.8 GHz and is already manufactured in the power efficient 14nm process. The integrated X9 LTE modem supports Cat. 7 with maximum transfer rates of 300 Mbps (downstream) and 150 Mbps (upstream). The SoC also includes an Adreno 506 GPU with support for Vulkan and OpenGL ES 3.1. WiFi 802.11ac (1x1, max 364 Mbps) and Bluetooth 4.1 are supported as well. The memory controller supports LPDDR3 (single channel) and the integrated video engine supports H.264 (encode and decode) and HEVC (only decode) in 1080p.

Mediatek Helio P25

The Mediatek Helio P25 is an upper mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2017. It is manufactured in a 16 nm FinFET+ process and is equipped with 8 ARM Cortex-A53 CPU cores. The cores are divided in two clusters, a performance cluster clocked at up to 2.6 GHz and a power efficiency cluster clocked at up to 1.6 GHz. The chip also includes an LTE modem (Cat. 6).

The integrated ARM Mali T880 MP2  GPU is clocked at up to 1000 MHz and has two cluster (from 16) from the Midgard (4th Gen) architecture.

Qualcomm Snapdragon 625

The Qualcomm Snapdragon 625 (SD625) is a mid-range octa-core SoC with eight ARM Cortex-A53 cpu cores at up to 2 GHz, an Adreno 506 GPU, a DDR3L-1866 memory controller and a X9 LTE (Cat 7, 4G+, 300 Mbps down, 150 Mbps up) modem. Furthermore, the chip supports 802.11ac WiFi and Bluetooth 4.1. It is manufactured in 14nm FinFet. The processor performance should be similar to a HiSilicon Kirin 650, which also offers 8 Cortex A53 cores at up to 2 GHz. However, due to the modern manufacturing process, power consumption and throttling should be better with the Snapdragon 625.