HiSilicon Kirin 710 vs HiSilicon Kirin 620

HiSilicon Kirin 710

The HiSilicon Kirin 710 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2018 and contains 8 processor cores (4x Cortex-A73 at up to 2.2 GHz, 4x Cortex-A53 at up to 1.7 GHz, BigLITTLE), an ARM Mali G51 MP4, a dual-channel LPDDR4 memory controller and a LTE radio (600 Mbps down, 150 Mbps up). Therefore, the CPU part is similar to the Kirin 960 and 970 (both higher clocked), but the graphics card is a lot slower. 

The Kirin 710 is manufactured at TSMC in 12 nm (compared to the 16nm Kirin 960 and 10nm Kirin 970).

The HiSilicon Kirin 710F is the same chip with a different package (FCCSP - Flip Chip Chip Scale Package) and offers the same specifications (see e.g. our review of the Huawei P Smart Z).

HiSilicon Kirin 620

The HiSilicon Kirin 620 is an ARM-based octa core SoC for mid-range smartphones. It was announced at the end of 2014 and features eight ARM Cortex-A53 cores at 1.2 GHz (max.). Furthermore, the processor integrates a ARM Mali-450 MP4 graphics card, an LPDDR3 memory controller, an LTE Cat.4 modem, 802.11n WiFi and Bluetooth 4.0. The chip is manufactured in 28nm and relatively power efficient.