HiSilicon Kirin 710 vs Qualcomm Snapdragon 625 vs Qualcomm Snapdragon 425 (MSM8917)

HiSilicon Kirin 710

The HiSilicon Kirin 710 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2018 and contains 8 processor cores (4x Cortex-A73 at up to 2.2 GHz, 4x Cortex-A53 at up to 1.7 GHz, BigLITTLE), an ARM Mali G51 MP4, a dual-channel LPDDR4 memory controller and a LTE radio (600 Mbps down, 150 Mbps up). Therefore, the CPU part is similar to the Kirin 960 and 970 (both higher clocked), but the graphics card is a lot slower. 

The Kirin 710 is manufactured at TSMC in 12 nm (compared to the 16nm Kirin 960 and 10nm Kirin 970).

The HiSilicon Kirin 710F is the same chip with a different package (FCCSP - Flip Chip Chip Scale Package) and offers the same specifications (see e.g. our review of the Huawei P Smart Z).

Qualcomm Snapdragon 625

The Qualcomm Snapdragon 625 (SD625) is a mid-range octa-core SoC with eight ARM Cortex-A53 cpu cores at up to 2 GHz, an Adreno 506 GPU, a DDR3L-1866 memory controller and a X9 LTE (Cat 7, 4G+, 300 Mbps down, 150 Mbps up) modem. Furthermore, the chip supports 802.11ac WiFi and Bluetooth 4.1. It is manufactured in 14nm FinFet. The processor performance should be similar to a HiSilicon Kirin 650, which also offers 8 Cortex A53 cores at up to 2 GHz. However, due to the modern manufacturing process, power consumption and throttling should be better with the Snapdragon 625.

Qualcomm Snapdragon 425 (MSM8917)

The Qualcomm Snapdragon 425 (8917) is an ARM-based entry level SoC for tablets and smartphones (mostly Android based). It was announced in February 2016 and integrates four 64-Bit Cortex-A53 CPU cores (quad-core) that clock with up to 1.4 GHz. Furthermore, there is a Adreno 308 graphics card, a LPDDR3 memory controller (max. 667 MHz) and wireless radios for WiFi and 4G/LTE included in the chip.

The Cortex-A53 is the successor of the entry level Cortex-A7 CPU cores. The A53 is now capable of 64 Bit (ARMv8-ISA) and adressing more than 4 GB RAM. According to ARM the performance per MHz is a lot better and even surpasses a Cortex-A9 core.

The integrated Adreno 308 ist the integrated graphics card that supports OpenGL ES 3.0.

The integrated wireless radios support WiFi 802.11ac Wave 2, Bluetooth 4.1, GPS/GLONASS/Baidou, 2G, 3G and 4G (LTE Cat.4) standards. Futhermore, the SoC is able to decode 1080p videos in H.265 (encode only in H.264) and cameras with up to 13 MP.

The power consumption of the chip is ranging in the lower range, and therefore it is also suited for smaller smartphones. It is manufactured in 28 nm LP at TSMC.