MediaTek Dimensity 920 vs Qualcomm Snapdragon 778G+ 5G vs MediaTek Dimensity 8200-Ultra

MediaTek Dimensity 920

The Mediatek Dimensity 920 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores at up to 2.5 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 4 core ARM Mali-G68 MC4 GPU, a Wi-fi 6 modem, a LPDDR4x memory controller, a AI processing unit  and video de- and encoding.

The 5G modem supports Sub-6 GHz and dual SIM. The download speeds can reach up to 2.7 Gbit/s.

Compared to the older Dimensity 900, the 920 offers slightly higher clock speeds for the CPU and GPU.

The Dimensity 920 is manufactured in the modern 6nm process and should be very power efficient.

Qualcomm Snapdragon 778G+ 5G

The Qualcomm Snapdragon 778G+ 5G (SDM778G Plus 5G Mobile Platform) is a fast mid-range ARM-based SoC largely found on Android tablets and smartphones. It integrates eight cores (octa-core) divided into two clusters. A fast performance cluster with four cores based on the ARM Cortex-A78 architecture with up to 2.5 GHz and a power efficiency cluster with four small ARM Cortex-A55 cores at up to 1.9 GHz. Depending on the workload only single clusters or all cores can run at different clock speeds. Compared to the older non-plus variant, the 778G+ offers 100 MHz higher clocked CPU cores.

Thanks to the new Cortex-A78 cores, the CPU performance increases by up to 40% compared to the old Snapdragon 768G according to Qualcomm. In our benchmarks, the 778G+ is able to reach the performance of the old high end chip Kirin 990. 

The integrated X53 5G modem supports up to 3.3 Gbps with sub 6Ghz. The FastConnect 6900 Wi-Fi modem supports the current Wi-Fi 6e standard with 6GHz.

The integrated Qualcomm Adreno 642L offers a 40% higher performance compared to the old Adreno 620 in the predecessor. This is partly thanks to the fast memory controller with LPDDR5-3200 support.

The integrated 6th gen AI engine called Hexagon 770 offers a 2x improvement and up to 12 TOPS of performance. The Spectra 570 ISP (image signal processor) supports up to three cameras. The satellite system supports all major standards like Beidou, Galileo, GLONASS and GPS.

The G specifies an optimized SoC for gaming and e.g. Qualcomm offers updates for the graphics driver.

The Snapdragon 778G Plus is manufactured in the modern 6 nm process at TSMC (vs the 5LPE of the 780G).

MediaTek Dimensity 8200-Ultra

The MediaTek Dimensity 8200-Ultra is a upper mid-range ARM-based SoC (system-on-a-chip) that is manufactured using the modern 4 nm process. It was specially designed for use in Android smartphones and is in the upper class in terms of performance. It supports all current mobile communication standards, including 5G SA. 

The CPU works with a total of eight cores, which are divided into two clusters. In the first cluster, an ARM Cortex-A78 power core clocked at 3.1 GHz is joined by three further ARM Cortex-A78 power cores clocked at 3 GHz. In the second cluster, four ARM Cortex-A55 power cores operate at 2.0 GHz. LPDDR5 RAM can be used as RAM and UFS 3.1 is supported as internal memory. 

In terms of connectivity, dual 5G with a theoretical peak download speed of up to 4.7 GBit/s is available, as well as WiFi 6E and Bluetooth 5.3.

The Mediatek Dimensity 8200-Ultra is a variant of the otherwise identical Mediatek Dimensity 8200 that has been specially customised for Xiaomi and features improvements to the camera ISP. An Imagiq 785 image processor is responsible for processing the camera data. Video recordings are supported with up to 4K at 60 fps. The CPU part of the older Dimensity 8100 is very similar and offers the same CPU and GPU cores.

The integrated ARM Mali-G610 MC6 graphics unit can power displays with a resolution of up to 2,960 x 1,440 pixels (WQHD+) and a refresh rate of up to 120 Hz. With Full HD+, even up to 180 Hz is possible.