MediaTek Dimensity 920 vs Qualcomm Snapdragon 765G vs MediaTek Dimensity 7030

MediaTek Dimensity 920

The Mediatek Dimensity 920 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores at up to 2.5 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 4 core ARM Mali-G68 MC4 GPU, a Wi-fi 6 modem, a LPDDR4x memory controller, a AI processing unit  and video de- and encoding.

The 5G modem supports Sub-6 GHz and dual SIM. The download speeds can reach up to 2.7 Gbit/s.

Compared to the older Dimensity 900, the 920 offers slightly higher clock speeds for the CPU and GPU.

The Dimensity 920 is manufactured in the modern 6nm process and should be very power efficient.

Qualcomm Snapdragon 765G

The Qualcomm Snapdragon 765G (SD765G Mobile Platform) is a fast mid-range ARM-based SoC largely found on Android tablets and smartphones. It integrates eight cores (octa-core, called Kryo 475) divided into two clusters. A fast performance cluster contains two ARM Cortex-A76 cores clocked at up to 2.4 GHz (prime core) and 2.2 GHz (gold core) and a power efficiency cluster with six small ARM Cortex-A55 cores at up to 1.8 GHz. Depending on the workload only single clusters or all cores can run at different clock speeds.

Compared to the normal Snapdragon 765, the 765G is optimized for gaming. This means the graphics card is higher clocked and the chip also supports additional software features (Snapdragon Elite Gaming like Game Smoother, Game Fast Loader and Game Network Latency Manager).

The processor performance is quite comparable to the old Snapdragon 730G. Only the single core performance can be slightly better, thanks to the higher clocked prime core (+200 MHz = 9% higher).

The chip is one of the first SoCs that integrate a 5G modem. It is called Snapdragon X52 and supports speeds of up to 3.7 / 1.6 Mbps (down- and upload) and mmWave and Sub-6.

The integrated Adreno 620 is also higher clocked compared to the one in the normal 765 and should result in 10% higher performance (according to QC).

The integrated AI engine uses the GPU, CPU and dedicated cores to reach a theoretical maximum performance of 5.5 TOPS.

The processor is manufactured in the modern and energy efficient 7nm EUV process at Samsung. 

MediaTek Dimensity 7030

The Mediatek Dimensity 7030 is a mid-range ARM SoC (system-on-a-chip) that can be used in both smartphones and tablets (mainly Android). The SoC was introduced in September 2023.

It includes a 5G modem and supports the latest mobile phone standards in dual-SIM mode with both cards, so that surfing and phoning is possible via two different cards at the same time. The SoC integrates two ARM Cortex A78 cores with up to 2.5 GHz for demanding tasks and six low-power ARM Cortex A55 cores with clock speeds of up to 2 GHz.

The chip has an integrated sub-6 GHz and mmWave 5G modem including dual-SIM support that can reach a maximum download speed of up to 4.6 Gbps. Wi-Fi 6E (802.11ax) is supported as well as Bluetooth 5.2. 

The memory controller can cope with LPDDR4x or LPDDR5 working memory as well as UFS 3.1 mass storage. As an integrated graphics card, the SoC uses the Mali-G610 MP3, which supports displays with 144 Hz as well as HDR10+ Adaptive, HLG and Dolby Vision at a maximum resolution of 2,520 x 1,080 pixels.

Compared to the Dimensity 920, the CPU unit has the same clock speeds but a more modern instruction set, ARMv8.2-A. A new graphics unit is used and WiFi 6E is supported, as well as displays with up to 144 Hz.

The SoC is manufactured in a 6nm process.