MediaTek Dimensity 820 vs Qualcomm Snapdragon 888 4G vs Qualcomm Snapdragon G3x Gen 1

MediaTek Dimensity 820

The Mediatek Dimensity 820 is a fast mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A76 cores at up to 2.6 GHz and four power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 5 core ARM Mali-G57 MC5 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller, a AI processing unit (APU 3.0) and video de- and encoding. The Dimensity 820 is manufactured in the modern 7nm process and should be very power efficient.

Qualcomm Snapdragon 888 4G

The Qualcomm Snapdragon 888 4G Mobile Platform is a high-end SoC for smartphones that was introduced in mid 2021 and manufactured in 5 nm at Samsung. Compared to the earlier released Snapdragon 888 5G, the 4G variant only features a 4G LTE modem.

The chip integrates one “Prime Core” based on a ARM Cortex-X1 architecture clocked at up to 2.84 GHz. Three more performance cores are based on the A78 but clock up to 2.42 GHz. Furthermore, four energy saving cores are integrated that are based on the ARM Cortex-A55 architecture and clock at up to 1.8 GHz. In addition to the processor cores, the SoC integrates a WiFi 6e modem, a Hexagon 780 DSP (up to 26 TOPS of AI performance) and a Spectra 580 ISP. The integrated memory controller now supports faster LPDDR5 memory with up to 3,200 MHz. 

The performance of the processor cores should be around 15% better than the old Snapdragon 865+. The integrated Adreon 660 GPU should make a bigger jump by 35% (most likely compared to the SD 865).

Qualcomm Snapdragon G3x Gen 1

The Qualcomm Snapdragon G3x Gen 1 (model number: SG8175P) is a revised version of the Snapdragon 888+ 5Gwhich is intended for use in Android-based gaming handhelds and tablets.

The SoC (system-on-a-chip) integrates a fast ARM Cortex-X1-based "Kryo 680 Prime Core" with up to 3.00 GHz and three additional fast Kryo 680 Gold performance cores (Cortex-A78-based) with up to 2.42 GHz. To save power, four additional Kyro 680 Silver (ARM Cortex-A55 based) cores have also been integrated, which operate at up to 1.8 GHz. An Adreno 660 is responsible for graphics acceleration.

The integrated Snapdragon X60 5G modem enables download speeds of up to 7.5 Gbit/s and upload speeds of up to 3 Gbit/s and supports DSS, mmWave and Sub6. The integrated FastConnect 6900 Wi-Fi modem supports all common standards, including Wi-Fi 6E with 6 GHz. Bluetooth version 5.2 is on board.

The SoC is manufactured using the 5 nm EUV process.