MediaTek Dimensity 820 vs Qualcomm Snapdragon 778G 5G vs UNISOC T750

MediaTek Dimensity 820

The Mediatek Dimensity 820 is a fast mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A76 cores at up to 2.6 GHz and four power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 5 core ARM Mali-G57 MC5 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller, a AI processing unit (APU 3.0) and video de- and encoding. The Dimensity 820 is manufactured in the modern 7nm process and should be very power efficient.

Qualcomm Snapdragon 778G 5G

The Qualcomm Snapdragon 778G 5G (SDM778G 5G Mobile Platform) is a fast mid-range ARM-based SoC largely found on Android tablets and smartphones. It integrates eight cores (octa-core) divided into two clusters. A fast performance cluster with four cores based on the ARM Cortex-A78 architecture with up to 2.4 GHz and a power efficiency cluster with four small ARM Cortex-A55 cores at up to 1.8 GHz. Depending on the workload only single clusters or all cores can run at different clock speeds.

Thanks to the new Cortex-A78 cores, the CPU performance increases by up to 40% compared to the old Snapdragon 768G according to Qualcomm. In our benchmarks, the 778G is able to reach the performance of the old high end chip Kirin 990. 

The integrated X53 5G modem supports up to 3.3 Gbps with sub 6Ghz. The FastConnect 6900 Wi-Fi modem supports the current Wi-Fi 6e standard with 6GHz.

The integrated Qualcomm Adreno 642L offers a 40% higher performance compared to the old Adreno 620 in the predecessor. This is partly thanks to the fast memory controller with LPDDR5-3200 support.

The integrated 6th gen AI engine called Hexagon 770 offers a 2x improvement and up to 12 TOPS of performance. The Spectra 570 ISP (image signal processor) supports up to three cameras. The satellite system supports all major standards like Beidou, Galileo, GLONASS and GPS.

The G specifies an optimized SoC for gaming and e.g. Qualcomm offers updates for the graphics driver.

The Snapdragon 778G is manufactured in the modern 6 nm process at TSMC (vs the 5LPE of the 780G).

UNISOC T750

The Unisoc T750 (Tanggula, former Spreadtrum) is a mid range SoC for Android based smartphones and tablets. It integrates an octa-core CPU with two clusters. Two fast ARM Cortex-A76 cores clocked at up to 2 GHz and six small ARM-Cortex-A55 cores at again up to 1.8 GHz for efficiency. The faster T760 SoC offers two more A76 cores, a faster GPU and a faster memory controller.

The integrated memory controller supports LPDDR4X with up to 1866 MHz. The integrated ISP supports two main cameras (up to 64 MPix). The integrated graphics card is an ARM Mali-G57 MC2 (2 cores) at up to 680 MHz. The integrated modem supports Wi-Fi 5 WLAN, 5G (TDD+FDD CA Sub-6GHz), and Cat15DL / Cat18 UL LTE.

The chip is manufactured in the modern 6nm process.