MediaTek Dimensity 820 vs Qualcomm QCM6490

MediaTek Dimensity 820

The Mediatek Dimensity 820 is a fast mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A76 cores at up to 2.6 GHz and four power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 5 core ARM Mali-G57 MC5 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller, a AI processing unit (APU 3.0) and video de- and encoding. The Dimensity 820 is manufactured in the modern 7nm process and should be very power efficient.

Qualcomm QCM6490

The Qualcomm QCM6490 is an upper mid-range SoC and is based on the Snapdragon 778G, but this variant is an extended-life chipset. The QCM6490 is being used for the first time in the Android smartphone Fairphone 5, but has actually been designed for corporate use and IoT applications.

The Kyro 670 CPU consists of a total of eight cores, which are divided into three clusters. The first cluster consists of just one high-performance core (Kyro Gold Plus, Cortex-A78), which operates at up to 2.71 GHz. The second cluster contains three further Cortex-A78 cores (Kyro Gold), each clocking at up to 2.40 GHz. The remaining four power-saving cores (Kyro Silver, Cortex-A55) are located in the last cluster and operate at up to 1.96 GHz. For the graphics calculations, an Adreno 643 with 812 MHz is integrated.

The QCM6490 SoC has an integrated 5G modem that supports both 5G-Sub6 and 5G-mmWave. In theory, this enables data rates of up to 3.7 Gbit/s downlink and 2.5 Gbit/s upload. Wi-Fi 6E is also on board, which supports the 6 GHz band.

The SoC is manufactured using the 6 nm process.