MediaTek Dimensity 810 vs MediaTek Dimensity 900 vs MediaTek Dimensity 8100

MediaTek Dimensity 810

The Mediatek Dimensity 810 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.4 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller(up to 16 GB with 2133 MHz), a AI processing unit (APU 3.0) and video de- and encoding.

The integrated 5G modem supports dual-5G (Sub6) with up to 2.77 GBit/s download. 

The Dimensity 800 is manufactured in the modern 6nm process at TSMC and should be very power efficient.

MediaTek Dimensity 900

The Mediatek Dimensity 900 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores at up to 2.4 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 4 core ARM Mali-G68 MC4 GPU, a Wi-fi 6 modem, a LPDDR4x memory controller, a AI processing unit  and video de- and encoding.

The Dimensity 900 is manufactured in the modern 6nm process and should be very power efficient.

MediaTek Dimensity 8100

The Mediatek Dimensity 8100 is a upper mid-range smartphone SoC. The CPU integrates four fast ARM Cortex-A78 cores with up to 2.85 GHz and four efficient Cortex-A55 cores with up to 2 GHz. The integrated 5G modem supports all modern standards including 5G SA and a maximum download speed of 4.7 Gbps.

The integrated ARM Mali-G610 MC6 GPU integrates 6 cores and supports displays with up to 2,960 x 1,440 pixels (WQHD+).

The chip is produced at TSMC in 5nm.