MediaTek Dimensity 8050 vs Qualcomm Snapdragon 8 Gen 2 vs MediaTek Dimensity 7020
MediaTek Dimensity 8050
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The MediaTek Dimensity 8050 is an ARM-based SoC (System-on-a-Chip) manufactured at TSMC using the 6nm process. It supports all current mobile standards including dual-SIM 5G (5G SA & NSA, max 4.7 Gbps download and 2.5 Gbps upload). The SoC also supports Wi-Fi 6 and Bluetooth 5.2.
The MediaTek Dimensity 8050 was specially designed for use in Android smartphones and is classified in the upper mid-range in terms of performance.
The CPU part consists of three clusters: a fast performance core, based on the ARM Cortex A78 architecture and clocked at up to 3 GHz. The second cluster consists of three Cortex-A78 cores with up to 2.6 GHz. Four ARM Cortex-A55 cores with up to 2 GHz are installed as a power-saving cluster.
The integrated ARM Mali-G77 MC9 graphics unit can drive displays with a resolution of up to 2,560 x 1,080 and a refresh rate of up to 144 Hz (possibly only with Full HD+).
Technically, the SoC is similar to the older Dimensity 1300.
Qualcomm Snapdragon 8 Gen 2
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The Qualcomm Snapdragon 8 Gen 2 Mobile Platform is a high-end SoC for smartphones that was introduced in late 2022 and manufactured in 4 nm at TSMC (N4P). It integrates four different CPU clusters. A fast and big prime core based on the ARM Cortex-X3 architecture and clocked at up to 3.2 GHz for 64 bit applications. Two more ARM Cortex-A715 based performance cores clocked at up to 2.8 GHz (also only for 64 bit apps). Two more Cortex-A710 performance cores at up to 2.8 GHz that can also be used for older apps and three efficiency cores (ARM Cortex-A510 with up to 2 GHz). All cores can use the shared 8 MB level 3 cache.
Thanks to the new architecture and high clock rates, the SD 8 Gen 2 is the fastest mobile CPU for Android based devices and is only topped by current Apple SoCs like the Apple A16 (see benchmarks below).
The chip also integrates a Hexagon accelerator for AI workloads (tensor, scalar and vector). Qualcomm states that its one of the first chips with INT4 support and up to 4.35x performance compared to the previous generation.
The 18-Bit-Spectra ISP is able to process photos with up to 200 MP and work with videos up to 8k30 (including 10-bit, HDR10+, HLG and Dolby Vision).
A big improvement of the Snapdragon 8 G2 is the integrated Adreno 740 GPU, that now supports Hardware Raytracing and tops even the iGPU in the Apple A16.
The integrated AI Engine can offer up to 4x faster AI performance thanks to the bigger Tensor engine. The 18-Bit-Spectra-ISP also saw some big improvements and is now called Snapdragon Sight.
The integrated Adreno 730 offers a 30% graphics boost compared to the previous Adreno 660.
The integrated Snapdragon X70 5G modem is also new as is the FastConnect 7800 modem with Wi-Fi 7 and Bluetooth 5.3 support.
MediaTek Dimensity 7020
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The Mediatek Dimensity 7020 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a IMG BXM-8-256 GPU, a Wi-Fi 5 modem, a LPDDR5 / LPDDR4X memory controller, a AI processing unit and video de- and encoding.
The 5G modem supports NR 2CC and mixed duplex (TDD/FDD) and dual SIM. The download speeds can reach up to 2.77 Gbit/s.
Compared to the Dimensity 930, the 7020 offers the same specifications and seems to be a rebrand.
The Dimensity 930 and 7020 are manufactured in the modern 6nm process and should be very power efficient.
Model | MediaTek Dimensity 8050 | Qualcomm Snapdragon 8 Gen 2 | MediaTek Dimensity 7020 | ||||||||
Codename | Cortex-A78 / A55 | Cortex-X3 / A715 / A710 / A510 (Kryo) | Cortex-A78 / A55 | ||||||||
Clock | 2000 - 3000 MHz | 2000 - 3200 MHz | 2000 - 2500 MHz | ||||||||
Cores / Threads | 8 / 8 1 x 3.0 GHz ARM Cortex-A78 3 x 2.6 GHz ARM Cortex-A78 4 x 2.0 GHz ARM Cortex-A55 | 8 / 8 1 x 3.2 GHz ARM Cortex-X3 2 x 2.8 GHz ARM Cortex-A715 2 x 2.8 GHz ARM Cortex-A710 3 x 2.0 GHz ARM Cortex-A510 | 8 / 8 2 x 2.2 GHz ARM Cortex-A78 6 x 2.0 GHz ARM Cortex-A55 | ||||||||
Technology | 6 nm | 4 nm | 6 nm | ||||||||
Features | 1x ARM Cortex-A77 (3 GHz), 3x ARM Cortex-A77 (2.6 GHz), 4x ARM Cortex-A55 (2 GHz), ARM Mali-G77 MP9, APU 570, 5G Modem, MiraVision HDR10+, Wi-Fi 6, Bluetooth 5.2, UFS 3.1, LPDDR4x | Adreno GPU, Spectra ISP, Hexagon, X70 5G Modem, FastConnect 7800 Wi-Fi 7, LPDDR5x 4200 MHz Memory Controller | 2x ARM Cortex-A78 (2.2 GHz), 6x ARM Cortex-A55 (2 GHz), PowerVR BXM-8-256, 5G 2CC-CA FDD+TDD, Dual 5G SIM, Dual VoNR, UFS 3.1, LPDDR5 | ||||||||
iGPU | ARM Mali-G77 MP9 | Qualcomm Adreno 740 | IMG BXM-8-256 | ||||||||
Architecture | ARM | ARM v9 | ARM | ||||||||
Announced | |||||||||||
Manufacturer | www.mediatek.com | www.qualcomm.com | www.mediatek.com | ||||||||
Series | Qualcomm Snapdragon 8 | ||||||||||
Series: Snapdragon 8 Cortex-X3 / A715 / A710 / A510 (Kryo) |
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L3 Cache | 8 MB |
Benchmarks
Average Benchmarks MediaTek Dimensity 8050 → 100% n=15
Average Benchmarks Qualcomm Snapdragon 8 Gen 2 → 171% n=15
Average Benchmarks MediaTek Dimensity 7020 → 88% n=15

* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation