MediaTek Dimensity 6100+ vs Qualcomm Snapdragon 6s 4G Gen 1

MediaTek Dimensity 6100+

The Mediatek Dimensity 6100+ (or 6100 Plus, MT6835V/ZA) is a lower mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). The specifications are similar to the old Dimensity 700 SoC and nearly identical to the Dimensity 6020. Compared to the 6020, the 6100+ offers slightly higher 5 G speeds (3.3 vs 2.7 Gbps), Bluetooth 5.2 (vs 5.1) support, and is manufactured in the slightly improved 6nm process (vs 7nm).

Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x-2133 memory controller, a AI processing unit (APU 3.0) and video de- and encoding.

Qualcomm Snapdragon 6s 4G Gen 1

The Qualcomm Snapdragon 6s 4G Gen 1 (SM6115-AC) is a renamed Snapdragon 662 SoC of the lower mid-range for (Android based) smartphones and tablets. The processor unit contains 8 Kryo-260 CPU cores (4x ARM Cortex-A73 with up to 2.1 GHz and 4x ARM Cortex-A53 with up to 1.8 GHz). The Qualcomm Adreno 610 is used as the graphics unit

The SoC comes with the third generation of Qualcomm's AI Engine and also includes Bluetooth 5.1. It is interesting to note that Qualcomm describes the Wi-Fi capability as "WiFi-6-ready", meaning you can connect to a WiFi 6 network, but not all parts of the standard are supported. The new WPS3 security protocol can be used. Support for the HEIF image file format and the Indian satellite network NavIC are also new.

The performance should be very similar to the old Snapdragon 662 (see for benchmarks).

The Snapdragon X11 is integrated as an LTE modem, which supports LTE Cat.13 in the uplink and downlink, as well as 2x2 MIMO in the downlink. The maximum transmission speed is 390 MBit/s (download) and 150 MBit/s (upload).

In terms of mass storage, a maximum of UFS 2.1 is supported, the memory limits are 32 GB and LP4x.

The SoC is manufactured using the 11 nm process.