Qualcomm Snapdragon 630 vs HiSilicon Kirin 710

Qualcomm Snapdragon 630

The Qualcomm Snapdragon 630 (SDM630) is a mid-range octa-core SoC with eight ARM Cortex-A53 CPU cores at up to 2.2 GHz, an Adreno 508 GPU, a LPDDR4-2666 memory controller (1333 MHz) and a X12 LTE (Cat 12/13, 300 Mbps down, 150 Mbps up) modem. Furthermore, the chip supports 802.11ac WiFi and Bluetooth 5.0. It is manufactured in 14nm FinFet. The processor performance should similar to the older Snapdragon 626 which offers similar clock speeds. Compared to the 626, the 630 however supports faster memory and offers faster LTE, Wifi and Bluetooth standards.

HiSilicon Kirin 710

The HiSilicon Kirin 710 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2018 and contains 8 processor cores (4x Cortex-A73 at up to 2.2 GHz, 4x Cortex-A53 at up to 1.7 GHz, BigLITTLE), an ARM Mali G51 MP4, a dual-channel LPDDR4 memory controller and a LTE radio (600 Mbps down, 150 Mbps up). Therefore, the CPU part is similar to the Kirin 960 and 970 (both higher clocked), but the graphics card is a lot slower. 

The Kirin 710 is manufactured at TSMC in 12 nm (compared to the 16nm Kirin 960 and 10nm Kirin 970).

The HiSilicon Kirin 710F is the same chip with a different package (FCCSP - Flip Chip Chip Scale Package) and offers the same specifications (see e.g. our review of the Huawei P Smart Z).